铜箔基板的英文

• copper claded laminates (ccl)
• copper foil laminated

• "铜箔"英文翻译    clutch gold; copper foil
• "基"英文翻译    base; foundation
• "板"英文翻译    board; plank; plate
• "背胶铜箔基板" 英文翻译 :    rcc
• "铜箔" 英文翻译 :    clutch gold; copper foil
• "基板" 英文翻译 :    basal lamina; basal plates; basalia; base cover; base plate; basilar lamina; basilar plate; board; ccl; end plate; endplate; foundation plate; lamina basalis; main foundation; paranal lobes; paranal process; placode; raft; sclerobasis; substrate
• "覆金属箔基" 英文翻译 :    metal-clad bade material
• "薄铜箔" 英文翻译 :    thin co er foil; thin copper foil
• "纯铜箔" 英文翻译 :    copper foil
• "黄铜箔" 英文翻译 :    brass foil; flitter gold
• "青铜箔" 英文翻译 :    bronze foil
• "铜箔面" 英文翻译 :    co er-clad surface; copper-clad surface
• "铜箔线" 英文翻译 :    copper foil wire; wire copper foil
• "覆金属箔基材" 英文翻译 :    metal-clad bade material; metal-clad base material
• "履金属箔基材" 英文翻译 :    metal-clad base material
• "薄基板" 英文翻译 :    thin core
• "翅基板" 英文翻译 :    wing scale
• "酚基板" 英文翻译 :    phenolic resin copperclad laminate
• "共基板" 英文翻译 :    grounded-base
• "基板,底板" 英文翻译 :    base plate
• "基板,基片" 英文翻译 :    base-plate
• "基板蜡" 英文翻译 :    baseplate waxes; try-in wax
• "基板面" 英文翻译 :    real estate
• "基膜，基板" 英文翻译 :    basal lamina
• "孔基板" 英文翻译 :    pore plate

• Today , almost all electronic products are built on printed circuit boards ; and emc currently produces and supplies the printed circuit board industry with two of their key materials copper clad laminates and prepregs
  台光目前的产品即为供应制造印刷电路板所需的基本材料铜箔基板及粘合片。
• A majority portion of our product is for the manufacturing of multilayer printed circuit boards for computer and communication application . we design our products for high level multilayer applications and we pride ourselves at meeting the stringent quality requirements associated with such manufacturing process
  为配合未来市场发展趋势，台光的铜箔基板以高层次印刷电路板所需高性能薄基板为主，应用于轻薄短小的高性能资讯、通信电子产品。