微电子组装的英文

microelectronic packaging

microelectronics assembly technology

例句与用法

Abstract : in this article , we discuss the calculation method of the heat analysis in the multilayer rectangular model system when there is heat source in the upper surface of the system . this method can be used in the heat analysis of the design of integrated circuit , micro - electrical assembly unit , etc
文摘:研究上表面含热源的多层矩形模型半解析的热分析计算方法.该计算方法可以用于集成电路、混合电路和微电子组装件的热设计工作
Hic has been the important technical channel for realizing the small - scale , multi - functional , high - performance , highly reliable military electric equipment , for hic make good use of high - integration , high - speed and other characters of sic , and formed a new - generation advanced microelectronic assembly technique
混合集成电路( hic )充分利用半导体集成电路( sic )高集成度、高速等特点，形成新一代高级的微电子组装技术，并已成为实现军用电子装备小型化、多功能化、高性能化、高可靠性的重要技术途径。