球栅阵列的英文

ball grid array (bga)

• 球:    sphere; globe
• 栅:    railings; paling; ...
• 阵列:    array

例句与用法

1. At present , bga / csp is becoming the mainstream of the advanced ic package technology
   目前微电子球栅阵列尺寸封装( bga csp )正成为高端ic封装的主流技术。
2. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitchball grid array
   半导体器件机械标准化.表面安装半导体器件封装外形图绘制的一般规则.小螺距球栅阵列的设计指南
3. Recently , designers developed a new type of package : ball grid array ( bga ) package . the bga package has many i / o pins . because of this merit , this kind of package is used widely now . but the package has a new structrue , and the old routing algorithms are not used
   鉴于球栅阵列封装( bga )的优点,这种技术成为目前最广泛的封装形式。然而由于球栅阵列封装( bga )结构的特殊性,对于这种封装上的布线算法不同于普通的布线算法。