electronic packaging

• Electronic packaging series
  电子产品包装系列
• Experimental and numerical analysis of thermal deformation of electronic packages , qfp and mcm
  热变形的实验及数值分析
• The technique and mechanism to fabricate lightweight si - al composites for electronic packaging
  电子封装材料制备工艺的研究
• Recent advances in the study of moisture absorption in plastic electronic packaging
  吸收湿气对微电子塑料封装影响的研究进展
• Advances in research on aluminum silicon carbide electronic packaging composites and components
  电子封装材料及构件研究进展
• Research on high performance novel electronic packaging materials of silicon - based aluminum
  新型硅基铝金属高性能电子封装复合材料研究
• Flip chip technology has become one of the major joining technologies in electronic packaging
  摘要覆晶技术已成为电子构装中之主要接合技术之一。
• Hartmann , develops and produces bus backplane wiring and ? electronic packaging solutions in stuttgart
  Hartmann有30年以上的电子系统的生产和开发经验。
• Research status and development of high silicon aluminium alloy for light weight electronic package materials
  高硅铝合金轻质电子封装材料研究现状及进展
• With the continuous improvements of ic integration , the electronic packaging became more and more important
  随着芯片及集成的水平的不断提高，电子封装的作用也变得越来越重要。