When feature size comes to 0 . 35 m , interconnect delay has contributed 70 % to total delay . distribution of delay parameters lies on actual implementation of layout , which results in the fact that timing closure has become the chief problem . so synthesis technology must be based on timing to insure timing closure 特征尺寸进入0 . 35 m后，互连线延迟占到系统延迟的70以上，而延迟参数的分布又取决于版图的具体实现，导致时序收敛成为设计的首要问题，因此综合技术必须要基于时序，保证时序收敛。
An automatic flip chip bonder is a precision instrument used to align and bond one or more dies onto a substrate in semiconductor industry . it develops for the mass production of ic , mems and moems with small feature sizes and high precise bonding demands . an alignment system is one of the key components in flip chip bonders 全自动倒装贴片机( flipchipbonder )是半导体生产工艺中完成芯片和基底对准、键合的高精度自动化设备,适合于特征尺寸小,键合精度要求高的ic ( integratedcircuit ) 、 mems ( microelectromechanicalsystem ) 、 moems ( microopticalelectromechanicalsystems )等的大规模生产。
