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polyimide films造句

"polyimide films"是什么意思  
造句与例句手机版
  • Mica tapes-polyimide film-backed mica paper tapes
    云母带.聚酰亚胺薄膜粉云母带
  • Adhesive coated polyimide film for flexible printed circuits
    挠性印制电路用涂胶聚酰亚胺薄膜
  • Evaluation of polyimide film developing level in china
    我国聚酰亚胺薄膜制造技术发展水平的评估
  • Copper-clad laminates for flexible printed wiring boards polyester film, polyimide film
    柔性印制电路板用包铜层压板
  • The effect on thermal stability of polyimide films based on phthalimide end-capped odpa and oda
    聚酰亚胺薄膜热稳定性的影响
  • Studies of the structural conversion and property change of polyimide film during the carbonization
    膜碳化过程中结构和性能变化研究
  • The dopping effect of nano-inorganic on structure and dielectric properties of polyimide films
    无机纳米掺杂对聚酰亚胺薄膜的结构和介电性能影响
  • Measuring the relative dielectric constant of dupont 100hn and 100cr polyimide film under optical frequency
    两种聚酰亚胺薄膜光频相对介电常数的测定
  • Base material for printed circuits-specifications-flexible copper-clad polyimide film, general purpose grade
    印制电路板基材.第2部分:规范.第13节:通用柔性覆铜聚酰亚胺膜
  • Thermal expand coefficient of polyimide films at each temperature was measured in the process of thermal cycling
    摘要测量了聚酰亚胺薄膜在冷热循环过程中各温度点的热膨胀系数。
  • It's difficult to see polyimide films in a sentence. 用polyimide films造句挺难的
  • Base materials or printed circuits . part 2 : specifications . speciication no 13 : flexible copper-clad polyimide film, general purpose grade
    印刷电路用基材.第2部分:规范.13号规范:一般用途级包铜软聚酰亚胺薄膜
  • Base materials for printed circuits; part 2 : specifications; specification no . 13 : flexible copper-clad polyimide film, general purpose grade
    印制电路用基材.第2部分:规范.第13号规范:通用级软覆铜聚酰亚胺薄膜,通用级
  • Base materials for printed circuits . part 2 : specifications . specification no . 15 : flexible copper-clad polyimide films of defined flammability
    印制电路用基材.第2部分:规范.第15号规范:规定的易燃性的软覆铜聚酰亚胺薄膜
  • Specification for plastic films for electrical purposes-specifications for individual materials-requirements for polyimide films used for electrical insulation
    电工用塑料薄膜规范.各型材料规范.电绝缘用聚酰亚胺薄膜要求
  • Specifications for pressure-sensitive adhesive tapes for electrical purposes-specifications for individual materials-polyimide film tapes with pressure-sensitive adhesive
    电气用压敏胶带规范.单个材料规范.带压敏胶粘剂的聚酰亚胺膜带
  • The results showe that the thermal expand coefficient of polyimide film is instability, it tends to stabilization after four times of psychro-thermal cycles
    结果表明:聚酰亚胺薄膜的热膨胀系数具有不稳定性,当经四次冷热循环后才趋于稳定。
  • Pressure-sensitive adhesive tapes for electrical purposes-part 3 : specifications for individual materials-sheet 7 : polyimide film tapes with pressure-sensitive adhesive
    电工用压敏粘带规范.第3部分:单项材料规范.第7活页:聚酰亚胺薄膜粘带
  • Pressure-sensitive adhesive tapes for electrical purposes . part 3 : specifications for individual materials . sheet 7 : polyimide film tapes with pressure-sensitive adhesive
    电工用压敏胶带.第3部分:专用材料规范.活页7:涂覆压敏胶的聚酰亚胺薄膜胶带
  • Specification for plastic films for electrical purposes . part 3 : specifications for individual materials . sheets 4 to 6 : requirements for polyimide films used for electrical insulation
    电气用塑料薄膜规范.第3部分:专用材料规范.活页4-6:电绝缘用聚酰亚胺薄膜要求
  • Specification for plastic films for electrical purposes; part 3 : specifications for individual materials; sheets 4 to 6 : requirements for polyimide films used for electrical insulation
    电工用塑料薄膜规范.第3部分:各别材料规范.第4-6活页:电绝缘用聚酰亚胺薄膜要求
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