polyimide film造句

• Mica tapes - polyimide film - backed mica paper tapes
  云母带.聚酰亚胺薄膜粉云母带
• Adhesive coated polyimide film for flexible printed circuits
  挠性印制电路用涂胶聚酰亚胺薄膜
• Evaluation of polyimide film developing level in china
  我国聚酰亚胺薄膜制造技术发展水平的评估
• Copper - clad laminates for flexible printed wiring boards polyester film , polyimide film
  柔性印制电路板用包铜层压板
• The effect on thermal stability of polyimide films based on phthalimide end - capped odpa and oda
  聚酰亚胺薄膜热稳定性的影响
• Studies of the structural conversion and property change of polyimide film during the carbonization
  膜碳化过程中结构和性能变化研究
• The dopping effect of nano - inorganic on structure and dielectric properties of polyimide films
  无机纳米掺杂对聚酰亚胺薄膜的结构和介电性能影响
• Measuring the relative dielectric constant of dupont 100hn and 100cr polyimide film under optical frequency
  两种聚酰亚胺薄膜光频相对介电常数的测定
• Base material for printed circuits - specifications - flexible copper - clad polyimide film , general purpose grade
  印制电路板基材.第2部分:规范.第13节:通用柔性覆铜聚酰亚胺膜
• Thermal expand coefficient of polyimide films at each temperature was measured in the process of thermal cycling
  摘要测量了聚酰亚胺薄膜在冷热循环过程中各温度点的热膨胀系数。
• Base materials or printed circuits . part 2 : specifications . speciication no 13 : flexible copper - clad polyimide film , general purpose grade
  印刷电路用基材.第2部分:规范. 13号规范:一般用途级包铜软聚酰亚胺薄膜
• Base materials for printed circuits ; part 2 : specifications ; specification no . 13 : flexible copper - clad polyimide film , general purpose grade
  印制电路用基材.第2部分:规范.第13号规范:通用级软覆铜聚酰亚胺薄膜,通用级
• Base materials for printed circuits . part 2 : specifications . specification no . 15 : flexible copper - clad polyimide films of defined flammability
  印制电路用基材.第2部分:规范.第15号规范:规定的易燃性的软覆铜聚酰亚胺薄膜
• Specification for plastic films for electrical purposes - specifications for individual materials - requirements for polyimide films used for electrical insulation
  电工用塑料薄膜规范.各型材料规范.电绝缘用聚酰亚胺薄膜要求
• Specifications for pressure - sensitive adhesive tapes for electrical purposes - specifications for individual materials - polyimide film tapes with pressure - sensitive adhesive
  电气用压敏胶带规范.单个材料规范.带压敏胶粘剂的聚酰亚胺膜带
• The results showe that the thermal expand coefficient of polyimide film is instability , it tends to stabilization after four times of psychro - thermal cycles
  结果表明：聚酰亚胺薄膜的热膨胀系数具有不稳定性，当经四次冷热循环后才趋于稳定。
• Pressure - sensitive adhesive tapes for electrical purposes - part 3 : specifications for individual materials - sheet 7 : polyimide film tapes with pressure - sensitive adhesive
  电工用压敏粘带规范.第3部分:单项材料规范.第7活页:聚酰亚胺薄膜粘带
• Pressure - sensitive adhesive tapes for electrical purposes . part 3 : specifications for individual materials . sheet 7 : polyimide film tapes with pressure - sensitive adhesive
  电工用压敏胶带.第3部分:专用材料规范.活页7 :涂覆压敏胶的聚酰亚胺薄膜胶带
• Specification for plastic films for electrical purposes . part 3 : specifications for individual materials . sheets 4 to 6 : requirements for polyimide films used for electrical insulation
  电气用塑料薄膜规范.第3部分:专用材料规范.活页4 - 6 :电绝缘用聚酰亚胺薄膜要求
• Specification for plastic films for electrical purposes ; part 3 : specifications for individual materials ; sheets 4 to 6 : requirements for polyimide films used for electrical insulation
  电工用塑料薄膜规范.第3部分:各别材料规范.第4 - 6活页:电绝缘用聚酰亚胺薄膜要求