多芯片组件的英文

• mcm multil chicarrier

• "多"英文翻译    many; much; more
• "芯片"英文翻译    slug; chip; die; wafer
• "多芯片组件, 多芯片模块" 英文翻译 :    multichip module
• "叠层基板多芯片组件" 英文翻译 :    mcm-l mcm with laminated substrate
• "陶瓷基板多芯片组件" 英文翻译 :    mcm-c mcm with ceramic substrate
• "单芯片组件" 英文翻译 :    scm single chimodule
• "淀积薄膜互连基板多芯片组件" 英文翻译 :    mcm-d mcm with deposited thin film inteconnect substrate
• "多芯片" 英文翻译 :    multi-chiic
• "芯片组件外观检查机" 英文翻译 :    components vision inspection system
• "芯片组" 英文翻译 :    almador almador; chip set; chip system; chipset
• "多芯片封装" 英文翻译 :    mcmultichipackage
• "多芯片模块" 英文翻译 :    mcms; multichimodule; multi-chimodule(mcm)
• "多芯片模组" 英文翻译 :    multichimodule
• "多芯片系统" 英文翻译 :    multichip system
• "芯片组分类" 英文翻译 :    grade die sort
• "芯片组装" 英文翻译 :    chip mounting
• "多芯片微电路" 英文翻译 :    microcircuit multichip; microcircuit, multichip
• "型(多芯片模块)" 英文翻译 :    ic
• "多芯片芯片模块" 英文翻译 :    multi-chip-module
• "单片组件" 英文翻译 :    monolithic module; single die package; single die per package
• "多片组件" 英文翻译 :    multiple device
• "刮片组件" 英文翻译 :    cleaning edge; filter shaft
• "簧片组件" 英文翻译 :    spring assembly
• "滤光片组件" 英文翻译 :    optical filter box
• "圆片组件" 英文翻译 :    wafer package

• In this paper the applications of diamond material to mcm to improve thermal characteristics and thermal stress problem are studied
  本文研究了金刚石材料在多芯片组件中热特性改善和热应力问题。
• Results in the paper will supply references to thermal designs of multi - chip module packaging based on diamond material
  本文对金刚石材料在多芯片组件热性能改善和热应力研究,对金刚石在多芯片组件封装热设计应用具有一定的参考价值和提供一定的理论依据。
• Firstly , background of the project was introduced , including characters of multi - chip module , electronic design automation and our destination
  首先介绍了该课题的背景，包括多芯片组件的发展与特点，现代电子设计自动化的相关进展，以及我们的工作目标。
• In this paper outlining the characteristics of diamond substrate and problems to be faced with , and measures to be taken , introducing knowledge of multi - chips modules packaging
  本文首先综述了热沉用金刚石基板的特点和面临的问题及相应的措施;并介绍了多芯片组件封装技术相关知识。
• Coverage ranges from thermal properties and semiconductor materials to mosfets , digital logic families , memory devices , microprocessors , digital - to - analog and analog - to - digital converters , digital filters , and multichip module technology
  覆盖范围从热性能和半导体材料的mosfet ，数字逻辑家庭，记忆体装置，微处理器，数位类比和模拟到数字转换器，数字滤波器，以及多芯片组件技术。
• Multichip module ( mcm ) is high - level mode in electronic package . mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate . mcm can meet the demands of compact packaging and high density
  多芯片组件( mcm )是微电子封装的高级形式，它是把裸芯片与微型元件组装在同一个高密度布线基板上，组成能够完成一定的功能的模块甚至子系统。
• With the rapid development of integrate circuit and electronic products various packaging modes and packaging technologies are developed . multi - chip module ( mcm ) packaging technologies rapidly develop because of it ’ s characteristic of improving frequency and increasing transmission speed and so on
  多芯片组件( multi - chipmodule即mcm )封装技术因组装密度高,改善了频率特性和传输速度等一系列优点获得了迅速发展。
• Being based on actual multi - chips module packaging structure a three dimensional thermal analysis model is built , thermal analysis on multi - chips module is conducted using diamond substrate and thermal interfacial materials ; a two dimensional and three dimensional chip - adhesive ? substrate thermal stress model are built , and interfacial thermal stress distributions are computed based on different area ratios and thickness ratios of substrate to chip
  本文根据实际的多芯片组件的封装结构,建立了三维温度场分析模型,分析了金刚石作为导热层和基板对多芯片组件散热性能的改善;建立了二维和三维的芯片-粘结层-基板热力学模型,分析了不同的基板/芯片厚度比和面积比对层间热应力分布的影响。