层电阻的英文
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"层电阻"怎么读用"层电阻"造句
英文翻译手机版
- layer resistance
- "层"英文翻译 I storey; tier; stratum
- "电阻"英文翻译 resistance; electric resista ...
- "薄层电阻" 英文翻译 : sheet resistance
- "薄层电阻率" 英文翻译 : sheet resistivity
- "层电阻率" 英文翻译 : layer resistivity; layerresistivity
- "磁层电阻" 英文翻译 : magnetic coating resistance; magnetic layer resistance
- "磁涂层电阻" 英文翻译 : magnetic coating resistance
- "地层电阻仪" 英文翻译 : strata scout
- "分层电阻" 英文翻译 : lamination stack resistance
- "扩散层电阻" 英文翻译 : diffused layer resistance; diffused-layed resistor
- "岩层电阻率" 英文翻译 : formation resistivity
- "真岩层电阻率" 英文翻译 : true formation resistivity
- "表面电阻;薄层电阻" 英文翻译 : resistance, sheet; sheet resistance
- "冲洗带地层电阻率" 英文翻译 : rxo flushed zone formation resistivity
- "地层电阻率系数" 英文翻译 : formation resistivity factor; formationresistivityfactor
- "地层电阻率因数" 英文翻译 : formation resistivity factor
- "地层电阻率指数" 英文翻译 : formation resistivity index
- "单颗粒层电压敏电阻器" 英文翻译 : single grain layer varistor; single-idler electronic belt conveyor scale
- "粉尘层电阻率测定方法" 英文翻译 : determination for electrical resistivity of dust in layer
- "层电荷" 英文翻译 : layer charge
- "层电子" 英文翻译 : l-electron
- "电阻" 英文翻译 : (物质阻碍电流通过的性质) resistance; electric resistance (电路中两点间在一定压力下决定电流强度的一个物理量)◇电阻表 ohmmeter; resistance card; ohm gauge
- "k层电子" 英文翻译 : k electron; k shell electron; k-electron
- "l层电子" 英文翻译 : l electron
- "薄层电导" 英文翻译 : sheet conductance
例句与用法
- Test method for sheet resistance of gold plating layer
金电镀层薄层电阻测试方法 - Determination for electrical resistivity of dust in layer
粉尘层电阻率测定方法 - Research of the buried layer van der pauw and bar resistor
范德堡和条状结构埋层电阻的测试及研究 - Test method for resistivity of silicon epitaxial layers by area contacts three - probe techniques
硅外延层电阻率的面接触三探针.测试方法 - Test method for measuring resistivity of semiconductor silicon or sheet resistance of semiconductor films with a noncontact eddy - current gage
半导体硅片电阻率及硅薄膜薄层电阻测定非接触涡流法 - The forward calculation shown that when providing current through whole casing pipe , the electrical potential on surface is mainly effected by shallow resistivity anomaly , whereas when providing current only at gun perforation position , the electrical potential is on surface mainly effected by corresponding resistivity of gun perforation position
正演结果表明:在全井套管供电时,地表观测电位主要受浅层电阻率不均匀性的影响;在射孔段供电时,地表观测电位主要反映射孔段的电阻率分布。 - In this paper , the circuit used for testing sheet resistance is designed using single chip processor . additionally , we have expressed van der pauw function as a polynomial form through local and global reversal development by using the normalized polynomial match , being convenient not only for programming , but also for sheet resistance testing when using van der pauw and rymaszewski methods
本文还利用单片机系统设计了薄层电阻测试电路,对于程序中用到的范德堡隐函数,利用非线性反演和规范化拟合的方法推导出其多项式显函数形式。这不仅给对我们编写程序提供了方便,也为使用范德堡法和rymaszewski法测量薄层电阻提供了便利。 - The experimental instruments , apparatus and the means to prepare all the samples are introduced in the first section . in section 2 , the experimental system including the oxidization system and diffusion system , are introduced therein . in section 3 , the samples preparation including the pre - deposition , redistribution and re - oxidization , the samples of b doping , and the fabrication of ga - diffusion transistor , b - diffusion and the transistor formed by b diffusion following ga diffusion are detailed therein , and the as - prepared samples are analyzed by sims , srp and four point probe
首先介绍了制备各种样品所用的实验仪器、设备与方法;第二节中介绍了实验系统,包括氧化系统、扩散系统,第三节介绍了样品的制备,包括ga的预沉积、再分布、二次氧化样品,扩硼样品,以及扩嫁晶体管、扩硼晶体管和扩镰后再补充扩硼晶体管的制备流程;实验所得样品,借助二次离子质谱( sims ) 、扩展电阻( srp ) 、四探针薄层电阻等先进的测试分析方法进行分析。 - At present , the problem in testing sheet resistance for micro - areas is that probes must be set up at the suitable locations by handwork . in order to know the wafer ' s impurity distributing , we need test many times , so will waste a lot of time . if the wafer ' s diameter would be 300mm , this problem will be more serious . in this paper , image analysis is introduced , through pre - processing and edge picking - up , the probe tips are recognized . then probe tips will be aligned respectively in two perpendicular directions through driving stepper motors . thus the distribution of sheet resistance for whole wafer is got by automatic testing and it offers information for detecting the impurity distribution and the diffusion uniformity
这样,完成200mm ( 8时)圆片杂质的扩散分布需要对许多图形进行测试,需要花费很长的时间,当测试300mm硅片时问题就更为突出。本文将图象与视觉测量系统引入四探针测试系统中,对采集到的原始探针图像进行预处理、边缘提取等操作,以便实现探针针尖的识别,然后由电机控制实现探针的自动定位。这样测试系统可以自动获得全片的薄层电阻分布,为超大规模集成电路检测杂质分布和扩散的均匀性提供信息。
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