热沉的英文

• heat sink
• thermal sink

• 沉    sink
• 热沉层    heat-sink shell
• 热沉淀    heat precipitation; thermal precipitation; thermoprecipitation
• 热沉降    thermal precipitation
• 加热沉淀    coctoprecipitation; thermal precipitation
• 加热沉淀器    tone'smal precipitator
• 加热沉淀素    coctoprecipitin
• 加热沉淀原    coctoprecipitinogen
• 浅成热沉积    epithermal deposit
• 热沉淀反应    thermal precipitation
• 热沉淀器    thermal power company; thermal precipitator
• 热沉淀试验    thermoprecipitin test
• 热沉淀素    coctoprecipitin; thermoprecipitation; thermoprecipitin
• 热沉淀素原    thermoprecipitinogen
• 热沉淀原    thermoprecipitinogen
• 热沉定素    thermoprecipitin
• 热沉降板    heat sink plate
• 热沉降装置    thermal precipitation device
• 热沉结构    heat-sink design
• 热沉球蛋白    pyroglobulin
• 热沉系统    heat-sink system
• 热沉效应    heat sink effect
• 热沉淀法采样    sampling by thermal precipitation
• 热沉淀法取样    sampling by thermal precipitation
• 振动热沉淀器    oscillating thermal precipitator

• Robust optimization design for microchannel heat sinks
  微通道热沉的稳健优化设计
• Optimization design of structural size of microchannel cooling heat sink
  微槽冷却热沉结构尺寸的优化设计
• The paper analyzed and discussed two - dimensional heat sink in theory
  本文对二维的热沉问题进行了理论分析和讨论。
• The diamond film is grown on the horizontal power diodes as their heat sink
  将金刚石薄膜应用于功率二极管(横向)的热沉。
• Study of the heat transfer characteristics of phase - of - change thermal storage radiation heat sink
  辐射器式热沉的传热特性研究
• Good news travels fast . my warmest congratulations and wishes for many years of happiness together
  好事传千里。热沉地祝你们幸福到永远。
• The paper introduces the manufacture , application and developement prospect of a novel complex metal for heat sink
  介绍了新型热沉用复合金属材料的设计、制造、应用技术及发展前景。
• According to heat transfer and hydrodynamics , the thermal flow dynamics and the thermal resistance microchannel heatsink are analyzed
  根据传热学和流体力学理论，本论文对微通道热沉进行了热流模型分析，理论推导了微通道热沉的热阻。
• If the problem of heat radiation cannot be solved properly , it will lead to a quick temperature rise of laser diodes and may even lead to catastrophic optical damage ( cod )
  文章分析了半导体激光器的发热因素，并对了几种常见的热沉类型进行了分析研究。
• In this paper outlining the characteristics of diamond substrate and problems to be faced with , and measures to be taken , introducing knowledge of multi - chips modules packaging
  本文首先综述了热沉用金刚石基板的特点和面临的问题及相应的措施;并介绍了多芯片组件封装技术相关知识。

• 热沉的日语：ほうねつばん ヒートシンク きゅうねつき