芯片粘贴的英文

英文翻译手机版

While the chips are attached to substrates with different organic adhesives , the evolution trends of surface residual stress are alike
使用不同有机粘合剂于芯片粘贴时，应力演化过程基本相似。
The thesis focuses on the stress issue induced by die attachment in mems ( namely , micro - electronic - mechanical system ) packaging
本论文主要研究对mems封装中芯片粘贴于基板时所引起的应力问题。
While the chips are attached to near center or near a edge of subatrate , the mean , deviation and maximum are at the almost same level ; when the chip is attached near a corner , the deviation and the maximum is far larger than those of the above two positions ; during thermal treatment followed , the residual stress demonstrates a regular cycle trend when the chips are attached near center or edge of the substrate and fluctuates in a wide range when the chip is attached near a corner
当芯片粘贴在基板中心和靠近基板边缘的位置时粘合剂固化后残余应力的平均值、最大值和数值的分散性皆处于相接近的水平，而当粘贴在基板靠近一角的位置时应力分布状况则有很大不同：应力的分散性增大，应力最大值也远大于粘贴于另外两个位置时的值。