覆铜层压板的英文

• copper-clad laminate
• copperclad laminatee

• "覆"英文翻译    cover
• "铜"英文翻译    copper
• "金属基覆铜层压板" 英文翻译 :    metal base copper clad laminate
• "覆铜薄层压板" 英文翻译 :    co er clad laminate; copper clad laminate
• "覆铜箔层压板" 英文翻译 :    co er-clad laminate (ccl)
• "单面覆铜箔层压板" 英文翻译 :    single-sided copper-clad laminate
• "双面覆铜箔层压板" 英文翻译 :    double sided copper clad laminate
• "金属芯覆铜箔层压板" 英文翻译 :    metal core copper-clad laminate
• "印制电路用覆铜箔层压板试验方法" 英文翻译 :    test methods for copper-clad laminated sheets for printed circuits
• "印制电路用覆铜箔层压板通用规则" 英文翻译 :    general rules for copper-clad laminated sheets for printed circuits
• "印制电路用覆铜箔酚醛纸层压板" 英文翻译 :    phenolic cellulose paper copper-clad laminated sheets for printed circuits
• "印制电路用覆铜箔环氧玻璃布层压板" 英文翻译 :    epoxide woven glass fabric copper-clad laminated sheets for printed circuits
• "印制电路用覆铜箔环氧纸层压板" 英文翻译 :    epoxide cellulose paper copperclad laminated sheets for printed circuitss
• "层压板" 英文翻译 :    all-paper laminte; laminate sheet; laminated board; laminated fiber board; laminated sheet; laminated wood; lamination; plyboard; plywood; veneer sheet
• "包铝层压板" 英文翻译 :    aluminum-clad laminate
• "薄层压板" 英文翻译 :    thin laminate
• "布基层压板" 英文翻译 :    cloth laminate; fabric laminate; fabric-base laminated sheet
• "层压板, 胶木板" 英文翻译 :    bakelite board
• "层压板；迭层片" 英文翻译 :    laminated sheet
• "层压板材" 英文翻译 :    laminated sheet
• "层压板面" 英文翻译 :    unclad laminate surface
• "层压板镶边" 英文翻译 :    edge banding
• "层压板纸" 英文翻译 :    papreg
• "层压板制造" 英文翻译 :    laminated object manufacturing (lom)
• "触压层压板" 英文翻译 :    contact laminate

• Metal base copper - clad laminate
  金属基覆铜层压板
• , specifications - phenolic cellulose paper copper - clad laminated sheet of defined flammability vertical burning test , economic quality
  规范.限定燃烧特性的酚醛多孔覆铜层压板
• Specification for metal - clad base materials for printed circuits - silicone woven glass fabric copper - clad laminated sheet si - gc - cu - 13
  印制电路板用覆箔板.第13部分:硅酮玻璃布覆铜层压板si - gc - cu - 13
• Base materials for printed circuits . part 2 : specifications . specification no . 2 : phenolic cellulose paper copper - clad laminated sheet , economic quality
  印制电路用基材.第2部分:规范.第2号规范:经济型酚醛纤维素纸覆铜层压板
• Base materials for printed circuits - part 2 : specification - specification n o 2 : phenolic cellulose paper copper - clad laminated sheet , economic quality
  印制电路用基材.第2部分:规范.第2号规范:经济型酚醛纤维素纸覆铜层压板
• Base materials for printed circuits . part 2 : specifications . specification no . 1 : phenolic cellulose paper copper - clad laminated sheet , high electrical quality
  印制电路用基材.第2部分:规范.第1号规范:高电气质量的酚醛纤维素纸覆铜层压板
• Base materials for printed circuits . part 2 : specifications . specification no 4 : epoxide woven glass fabric copper - clad laminated sheet , general purpose grade
  印制电路基材.第2部分:规范.第4号规范:普通级环氧化合物编织的玻璃纤维覆铜层压板
• Base materials for printed circuits ; part 2 : specifications ; specification 2 : phenolic cellulose paper copper - clad laminated sheet , economic quality ; amendment 3
  印制电路用基材.第2部分:规范.第2号规范:酚醛纤维素纸覆铜层压板,经济质量.修改件3
• Base materials for printed circuits ; part 2 : specifications ; specification 1 : phenolic cellulose paper copper - clad laminated sheet , high electrical quality ; amendment 2
  印制电路用基材.第2部分:规范.第1号规范:高电气质量的酚醛纤维素纸覆铜层压板.修改件2
• Base materials for printed circuits - part 2 : specifications - specification no . 2 : phenolic cellulose paper copper - clad laminated sheet , economic quality ; amendment 5
  印制电路用基底材料.第2部分:规范.第2号规范:经济质量的酚醛纤维素纸覆铜层压板.修改件5