ic芯片的英文

• integrated circuit

• "ic"英文翻译     IC ＝ 1.integrated circ ...
• "芯片"英文翻译    slug; chip; die; wafer
• "-ic" 英文翻译 :     -ic1 后缀 〔构成形容词〕 1.表示“…的”，“…似的”，“…性的”： basic, poetic. 2.表示“与…有关的”： Asiatic, volcanic. 3.表示“由…产生的”，“由…引起的”： photographic, symphonic. 4.表示“由…组成的”，“含有…的”： alcoholic, dactylic. 5.表示“原子价较高的”〔指与 -ous 结尾的词相比〕： ferric, sulphuric. -ic2 后缀 〔构成名词〕 1.表示“学术”，“艺术”： arithmetic, logic, music. 2.表示“具有某种性质或特征”： classic, critic. 3.表示“呈现出…”，“受…影响”： rustic. 4.表示“产生”： anaesthetic.
• "ic" 英文翻译 :     IC ＝ 1.integrated circuit 【无线电】积体[集成]电路。 2.interior communications 内部通讯联络。
• "芯片" 英文翻译 :    slug; chip; die; wafer
• "bracket-ic ic" 英文翻译 :    支架
• "insat-ic insat-ic" 英文翻译 :    号卫星
• "intelligence card（ic） ic" 英文翻译 :    智能卡
• "bipolar ic" 英文翻译 :    双极集成电路
• "chickenina ic" 英文翻译 :    水晶鸡
• "clock ic" 英文翻译 :    钟电路
• "commodity ic" 英文翻译 :    标准规格的积体电路
• "custom ic" 英文翻译 :    定制的集成电路
• "differentiated ic" 英文翻译 :    差分集成电路
• "digital ic" 英文翻译 :    数字集成电路; 数字式集成电路
• "discrete ic" 英文翻译 :    分立集成电路; 离散式积体电路
• "driver ic" 英文翻译 :    显示面板用驱动
• "dry-ic" 英文翻译 :    乾冰
• "epidem ic" 英文翻译 :    哈佛希尔热
• "fore ic" 英文翻译 :    法庭的
• "gnei ic" 英文翻译 :    片麻状的
• "hall ic" 英文翻译 :    霍耳开关
• "horizontal ic" 英文翻译 :    水平集成电路
• "hybrid ic" 英文翻译 :    混合集成电路
• "ic 418" 英文翻译 :    呼吸器星云

• Since been manufactured in 1959 , integrated circuits have experienced a dramatic development
  从1959年第一批ic芯片制成到现在, ic产业经历了迅猛发展的半个世纪。
• Good quality : it adopts importing material which can emit light , good quality ic chip , non noise and the power of high power
  质量优良：采用进口发光材料，高品质ic芯片，无噪声大功率电源
• Electronic currency is a non - paper - based trading tool in modern society . its physical form is a card with magnetic strips or intelligence 1c chips
  电子货币在当代社会是一种非纸基货币支付工具，其表现形式主要为带有支付功能的磁条或加有智能ic芯片的卡片。
• According to statistics , by the end of 2006 , china had had 47 manufacturing lines of ic chips ; china had already overtaken japan and the united states , and become the world ' s largest ic market
  据统计，截至2006年底，我国已有47条ic芯片制造线，中国已超越日本和美国，跃升为全球最大的集成电路市场。
• The functions of an electronic package are to protect , power , and cool the microelectronic chips or components and provide electrical and mechanical connection of the microelectronic part to outside world
  每块集成电路( ic )芯片在使用前都需要封装。封装是ic芯片支撑、保护的必要条件，也是其功能实现的主要组成部分。
• This thesis discussed and analyzed the related theory and logical structure of logical cipher contactless ic card chip , and goes deep into research the lgorithm of cipher and identify ， the work principle , and the work process . on the base of studying and researching , we finished the design of logical cipher contactless ic card chip based stream cipher
  本文分析了非接触ic卡系统的相关理论和内部电路的逻辑结构，并对加密算法认证及卡的整个工作原理、过程等进行了深入研究，在此基础上，完成了基于流密码的非接触逻辑加密ic卡ic芯片的设计。
• Combining magnetic levitation technology and linear motor drive technology , applying cad / cae method , a new magnetic levitation precise stage is designed and researched , which is step and precise position mechanism in 1c chip manufacture equipment of micro - electronics trade such as laser photolithography equipment . it is an innovative research
  将磁悬浮技术和直线驱动技术相结合，采用cad cae技术手段设计研究了一种新型磁悬浮精密定位工作台，它是针对微电子行业ic芯片制造设备如光刻机而研制的快速步进、精密定位机构，是创新性研究。
• This task of self - determination design of high speed lvds i / o interface chip , as a part of the project " high speed digital signal interlink and transmit technology " on the foundation of national laboratory for parallel & distributed processing , on the one hand provide absolutely necessarily experiment foundation and hardware elements for the research of high speed digital signal transmission , on the other hand make an available exploration for the forward design methods of ic chips by means of full - custom and half - custom mixed design approach
  本课题对lvds高速i o接口单元芯片ftlvds的自主设计研究，作为国防科技重点实验室基金项目“高速数字信号互连与信号传输技术”的一部分，一方面为进行高速数字信号传输的研究提供了不可缺少的实验依据和硬件基础，另一方面也是对ic芯片正向设计中采用全定制和半定制的混合设计方法的一次有益探索。
• With the rapid development of the semiconductor process and relevant technology , beyond the traditional integrated circuit , system - on - a - chip ( soc ) is coming up . it consists of a lot of intellectual property ( ip ) blocks and embedded processors , which require a piece of embedded software code to be composed . with design complexity beyond the traditional chips , verification difficulty is growing up
  系统芯片是随着集成电路的发展而出现的新一代芯片,在系统芯片的设计中大量采用ip核复用技术,系统芯片中还包含有嵌入式的处理器,因而需要同时设计嵌入式的软件程序,其设计复杂度远远高于传统的ic芯片。
• The first step is to select the proper biometric features , and the fingerprint and facial are chosen . then the second step is to select the ic type , through analysis , philips p8rf5016 is chosen . based on security analysis , the basic structure and main function of the passport system are designed
  论文首先对生物特征技术的性能进行了分析，然后选择了指纹和面像技术作为电子护照的应用，其次是进行ic芯片的选型，通过分析，选择了philipsp8rf5016芯片，第三对系统进行了安全分析，针对安全分析，进行了系统的总体设计，包括系统的基本构成，主要功能和各部分功能的确定等等。