封装外壳的英文

package shell

• 封装:    package; potting; ...
• 外壳:    hull; incrustation ...
• 封装外形:    package outline

例句与用法

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1. Purged and pressurized enclosures for electrical equipment
   电气设备的清洗和加压封装外壳
2. Mechanical standardization of semiconductor devices - coding system and classification into forms of package outlines for semiconductor device packages
   半导体器件的机械标准化.半导体器件封装外壳形式的分类和编码系统
3. Mechanical standardization of semiconductor devices - part 4 : coding system and classification into forms of package outlines for semiconductor device packages
   半导体器件的机械标准化.第4部分:半导体器件封装外壳形式的分类和编码系统
4. Mechanical standardization of semiconductor devices - part 4 : coding system and classification into forms of package outlines for semiconductor device packages ; amendment 2
   半导体器件的机械标准化.第4部分:半导体器件封装外壳形式的分类和编码系统.修改件2
5. Major producers of electrical and electronic ceramics , engineering ceramics , ceramic thick - film integrated circuits , ceramics molybdenum , manganese , tungsten metal manganese , ceramic packages such as ceramics pieces
   主要生产电子电器陶瓷、工程陶瓷、陶瓷厚膜集成电路、陶瓷钼锰、钨锰金属化、陶瓷封装外壳等各种陶瓷瓷件。