封装外壳的英文

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"封装外壳"怎么读用"封装外壳"造句

英文翻译手机版

package shell

"封装"英文翻译 package; potting; encapsulat ...
"外壳"英文翻译 hull; incrustation; outer sk ...
"封装外形" 英文翻译 : package outline
"组装外壳" 英文翻译 : package shell
"密封装置外壳" 英文翻译 : gland housing
"装外表" 英文翻译 : surface
"封装" 英文翻译 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; packaging
"外壳" 英文翻译 : hull; incrustation; outer skin; outermost shell; case; shell; jacket; package; housing; skin; sleeve; body; outer covering; outer casing; crust; sheathing; exochite 电池外壳 battery case; 热水瓶外壳 the outer casing of a thermos flask; 这类甲虫有坚硬的外壳。 this kind of beetles have hard shell
"包装外皮脏" 英文翻译 : bale cover dirty
"给装外罩；房屋" 英文翻译 : house
"化装外衣" 英文翻译 : domino
"包装外表标志" 英文翻译 : marks on packing
"背心连裤童装外衣" 英文翻译 : rompers
"块装外加塑料袋" 英文翻译 : block covered with poly bag; bound with rope externally
"组装外径尺寸大床" 英文翻译 : king size
"internet封装" 英文翻译 : internet packages
"段封装" 英文翻译 : segment package
"封装，组装" 英文翻译 : packaging
"封装的" 英文翻译 : housed; potted
"封装盒" 英文翻译 : pentium2cpu
"封装机" 英文翻译 : packaging machine; sealing machine
"封装胶" 英文翻译 : blocking cement
"封装类" 英文翻译 : capsuleclasss
"封装片" 英文翻译 : case chip
"封装器" 英文翻译 : packetizer; tcp wrapper; wrapper

例句与用法

Purged and pressurized enclosures for electrical equipment
电气设备的清洗和加压封装外壳
Mechanical standardization of semiconductor devices - coding system and classification into forms of package outlines for semiconductor device packages
半导体器件的机械标准化.半导体器件封装外壳形式的分类和编码系统
Mechanical standardization of semiconductor devices - part 4 : coding system and classification into forms of package outlines for semiconductor device packages
半导体器件的机械标准化.第4部分:半导体器件封装外壳形式的分类和编码系统
Mechanical standardization of semiconductor devices - part 4 : coding system and classification into forms of package outlines for semiconductor device packages ; amendment 2
半导体器件的机械标准化.第4部分:半导体器件封装外壳形式的分类和编码系统.修改件2
Major producers of electrical and electronic ceramics , engineering ceramics , ceramic thick - film integrated circuits , ceramics molybdenum , manganese , tungsten metal manganese , ceramic packages such as ceramics pieces
主要生产电子电器陶瓷、工程陶瓷、陶瓷厚膜集成电路、陶瓷钼锰、钨锰金属化、陶瓷封装外壳等各种陶瓷瓷件。
Hardware circuits , encapsulation boxes and software of the smart devices were designed . the smart temperature sensor , smart pressure sensor , smart speed sensor , and smart positioning actuator were developed
设计了智能装置的硬件电路、封装外壳和相关软件，在实验室环境下研制完成了智能温度传感器、智能压力传感器、智能转速传感器和智能位置控制器。
The results of fe simulation shows that the mental package made abroad has lower thermal stress and higher reliability during working and manufacturing process than that made in china . it is mainly because that the two packaging structures were manufactured in different forming processes : one was punched and the other was brazed
有限元计算的结果表明，采用冲压一次成型的国外封装外壳比采用异材压焊的国产封装外壳的工作热应力和制造残余热应力要小很多，具有更高的可靠性。