封装形式的英文

• encapsulation mode/form/modality

• "封装"英文翻译    package; potting; encapsulat ...
• "形式"英文翻译    form; shape; layout; modalit ...
• "适用于表面安装的封装形式" 英文翻译 :    surface-mount package
• "准备把原在马来西亚生产的封装形式为" 英文翻译 :    sosm
• "安装形式" 英文翻译 :    installing form
• "包装形式" 英文翻译 :    packaged form
• "纱线包装形式" 英文翻译 :    yarn make-up; yarn put-up
• "仪表盘安装形式" 英文翻译 :    flush mount
• "多包装形式下货物配装问题的研究" 英文翻译 :    the research on the loading of goods under the situation of multi -packaging
• "封装" 英文翻译 :    [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; packaging
• "包装形象" 英文翻译 :    package packaging
• "包装形状" 英文翻译 :    shapes of packing
• "时装形象" 英文翻译 :    image fashion
• "包装形状改变" 英文翻译 :    shape of packing distorted; with outer packing wet
• "形式" 英文翻译 :    1.(事物的形状、结构等) form; shape; layout; modality 流于形式 become a mere formality; 形式多样 be various in forms; 形式和内容 form and content; 他已经肯定获得那份工作了, 口头审查仅是形式而已。 he is already assured of the job and his interview is a mere formality.2.[自动化] (数据安排) format; [数学] quantic; shape
• "internet封装" 英文翻译 :    internet packages
• "段封装" 英文翻译 :    segment package
• "封装，组装" 英文翻译 :    packaging
• "封装的" 英文翻译 :    housed; potted
• "封装盒" 英文翻译 :    pentium2cpu
• "封装机" 英文翻译 :    packaging machine; sealing machine
• "封装胶" 英文翻译 :    blocking cement
• "封装类" 英文翻译 :    capsuleclasss
• "封装片" 英文翻译 :    case chip
• "封装器" 英文翻译 :    packetizer; tcp wrapper; wrapper

• Packaged in bga and pga
  封装形式：
• Which command verifies encapsulation as well as layer 1 and layer 2 statistics on a router configured for frame relay
  在帧中继的配置中，哪一条命令可以用来校验数据在第一层和第二层上的封装形式
• Therefore , the traditional testing of packaging format has been not enough , and it moves up to the wafer level
  因此，传统使用封装形式的测试已不敷需求，渐渐往上游回溯至晶圆层级，被晶圆形式所取代。
• Work , good optical function , high dependable , low spoilage , good direction - sense , ware length evenness , good stability , used for every environment
  附加损耗低方向性好波长平坦性好环境稳定性好，适用于各种恶劣环境多种封装形式可选
• This thesis overall views the historical development , future trend , active devices . sensitivity definitions and configurations of microwave and millimeter mixers , and then discuss several kinds of mixers and mixer diodes
  本文系统地介绍了微波毫米波混频器的发展概况和今后的发展趋势、实现混频器的有源器件及其封装形式以及利用它们实现混频的优缺点。
• As an advanced package , 3 - d stacked csp assembly provides significant size and performance advantages than traditional single chip package . meanwhile , high packaging density tends to generate more power in a package and cause serious thermal problem
  三维叠层芯片尺寸封装( stackedchipscalepackage )是目前最先进的微电子封装形式之一,具有体积小、重量轻、封装效率高等特点。
• The transistor count is 3 . 8 million ; the package is surface mount 240 - pin quad flat pack ( qfp240 ) ; and the die size is 98mm2 ; the most advanced research progress on microprocessor architecture is extensively studied to get technical preparations for microprocessor design
  该处理器目前正在进行后端设计，即将采用0 . 25 mcmos工艺流片，整个处理器的晶体管数目为380万，封装形式是qfp240 ， die面积为98mm ~ 2 。
• Recently , designers developed a new type of package : ball grid array ( bga ) package . the bga package has many i / o pins . because of this merit , this kind of package is used widely now . but the package has a new structrue , and the old routing algorithms are not used
  鉴于球栅阵列封装( bga )的优点,这种技术成为目前最广泛的封装形式。然而由于球栅阵列封装( bga )结构的特殊性,对于这种封装上的布线算法不同于普通的布线算法。
• The main results are as follows : 1 ) firstly , this paper furtherly analyzes and research on the high - voltage isolation optocouplers , the forms of the package , the aging rule , the character of isolation - voltage , the basic parameters and the typical applications of optocouplers in detail
  主要内容为: 1 、首先对光电耦合器的结构特点、封装形式、老化规律、隔离电压特性、基本参数及典型应用等作了详细的分析和总结,为进一步的研究打下了深厚的理论基础。