封装技术的英文

lga (land grid arry)

packaging technique

• 封装:    package; potting; ...
• 技术:    technology; skill; ...
• 一种封装技术:    rambus dram

例句与用法

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1. Ultrathin wafer level chip size package technology
   超薄型圆片级芯片尺寸封装技术
2. Investigation of electroless nickel gold bump technology
   芯片封装技术的发展演变
3. Progress and application for mems packaging technologies
   封装技术的发展及应用
4. Csp causes the revolution of memory chip package technology
   引发内存封装技术的革命
5. Wlcsp wafer - level chip scale packaging technology
   晶圆片级芯片规模封装技术