焊球的英文

bead, solder

soldered ball

torch head

welded ball

+更多解释...

例句与用法

Bga transform and insulating substrate technology
焊球阵列转变与绝缘基板技术
Specification for solderability tester by globule method
焊球法可焊性测试仪.技术条件
Test methods for bare wires - solderability test of coating - solder globule method
裸电线试验方法镀层可焊性试验焊球法
In the five key factors of solder ball alloy , solder paste alloy , peak temperature , the time above liquidus and soldering environment , the fore four factors are more important than soldering environment to the solder joints reliability
在焊球合金、焊料合金、峰值温度、液相线以上时间和焊接环境五个关键因素中，前四项对焊点可靠性比较重要，焊接环境对焊点可靠性的影响不很显著。
Third , it analyzes different influences upon the life predication by comparing different models of the same package , different constitutive models of the same solder ball ' s materials , different life prediction models , different solder ball dimensions , different mesh density etc . finally , it compares some popular constitutive models of the solder ball materials , and constructs an integrated constitutive model by different curve fits
接着，又在上述分析的基础上，比较了同种封装的不同模型(如条形模型， 1 4模型， 1 8模型) 、相同焊球材料的不同本构模型、不同寿命预测模型、不同焊球尺寸及网格密度等方面对寿命预测的影响。