焊球的英文

• bead, solder
• soldered ball
• torch head
• welded ball
• weldedball

• "焊"英文翻译    weld; solder
• "球"英文翻译    sphere; globe
• "焊球法" 英文翻译 :    test methods for bare wiressolderability test of coatingsolder globule methodthod
• "焊球连接" 英文翻译 :    sbc solder-ball connection
• "焊球阵列" 英文翻译 :    bga ball grid array
• "焊球剪切强度" 英文翻译 :    bs ball shear strength
• "焊球阵列封装" 英文翻译 :    tbga
• "塑料焊球阵列" 英文翻译 :    pbga
• "陶瓷焊球阵列" 英文翻译 :    cbga ceramic ball grid array
• "焊球下金属化层" 英文翻译 :    ubm
• "焊球阵列封装技术" 英文翻译 :    cbga
• "焊青铜焊条" 英文翻译 :    bronze welding rod
• "焊桥" 英文翻译 :    bridge solder; solder bridge
• "焊枪嘴" 英文翻译 :    torch head
• "焊枪套帽" 英文翻译 :    torch head fitting
• "焊枪式点焊机" 英文翻译 :    gun welding machine

• Bga transform and insulating substrate technology
  焊球阵列转变与绝缘基板技术
• Specification for solderability tester by globule method
  焊球法可焊性测试仪.技术条件
• Test methods for bare wires - solderability test of coating - solder globule method
  裸电线试验方法镀层可焊性试验焊球法
• In the five key factors of solder ball alloy , solder paste alloy , peak temperature , the time above liquidus and soldering environment , the fore four factors are more important than soldering environment to the solder joints reliability
  在焊球合金、焊料合金、峰值温度、液相线以上时间和焊接环境五个关键因素中，前四项对焊点可靠性比较重要，焊接环境对焊点可靠性的影响不很显著。
• Third , it analyzes different influences upon the life predication by comparing different models of the same package , different constitutive models of the same solder ball ' s materials , different life prediction models , different solder ball dimensions , different mesh density etc . finally , it compares some popular constitutive models of the solder ball materials , and constructs an integrated constitutive model by different curve fits
  接着，又在上述分析的基础上，比较了同种封装的不同模型(如条形模型， 1 4模型， 1 8模型) 、相同焊球材料的不同本构模型、不同寿命预测模型、不同焊球尺寸及网格密度等方面对寿命预测的影响。

• 焊球的日语：はんだボール