砂轮磨削的英文

basic terminology for grinding processes using grinding wheels

• 砂轮:    emery cutter; knif ...
• 磨削:    grinding; ablation
• 凸轮磨削:    cam grinding

例句与用法

1. Basic terminology for grinding processes using grinding wheels
   砂轮磨削基本术语
2. Effect of grinding fluid on grinding properties of vitrified bonded cbn wheel
   砂轮磨削难加工材料时磨削液的作用
3. Basic quantities in cutting and grinding . part 5 : basic terminology for grinding processes using grinding wheels
   切割和磨削的基本量.第5部分:砂轮磨削工艺的基本术语
4. The results show that , when increasing the feed rate of the grinding wheel , decreasing the rotating speed of the wafer chuck table and using coarser grit grinding wheel , the material removal rate in the wafer rotating grinding increase , the feed rate of the grinding wheel has greater influence on the material removal rate ; when suitably increasing the rotating speed of the grinding wheel , decreasing the feed rate of the grinding wheel and using finer grit grinding wheel , the wafer surface roughness can be reduced ; there exists a critical rotating speed of the grinding wheel ( about 2300rpm ) , beyond which the material removal rate evidently decreases and the spindle motor current and wafer surface roughness steeply increase ; when the grit size of the grinding wheel is finer than # 2000 , the material removal rate decreases and the wafer surface roughness has no obvious improvement
   研究结果表明，增大砂轮轴向进给速度和减小工件转速，采用粗粒度砂轮有利于提高磨削矽片的材料去除率，砂轮轴向进给速度对材料去除率的影响最为显著；适当增大砂轮转速，减小砂轮轴向进给速度，采用细粒度砂轮可以减小磨削表面粗糙度；在其它条件一定的情况下，砂轮速度超过一定值会导致材料去除率减小，主轴电机电流急剧增大，表面粗糙度变差；采用比# 2000粒度更细的砂轮磨削时，材料去除率减小，矽片表面粗糙度没有明显改善。
5. Which include cutting - edge curves , rake & flank face , edge angle , tool paths of enveloping rake & flank face , post processing technique of coordinate transfer , design - analyse and simulation sofeware . the research would offer sufficient academic basics and direction about manufacturing of ball - end cutters on the existing nc grinder
   其中包括了球头立铣刀的刃口曲线模型,前、后刀面模型,刀具角度分析,砂轮磨削前、后刀面的刀位轨迹模型,刀位轨迹与机床坐标转换的后置处理,球头立铣刀的设计与仿真软件的开发。