Hmic ( hybride microwave integrated circuit ) technology is used in the design of phase shifter in this paper . it needs high technology and cost for mcm and mmic . so hmic has many superior advantages . it is very convenient to produce and debug 单片集成电路( mmic )和多芯片模块电路( mcm )对工艺要求很高,且造价昂贵,混合集成电路具有加工和调试方便,生产成本低等突出优点。
Then introduce the key techniques of mfs : the mcm technique , the advanced composite technique , the electric connection technique , and the thermal control technique . then determine the target of this paper 本文首先从多功能结构的概念入手,简要介绍了多功能结构的几项关键技术:多芯片模块技术、先进复合材料技术、无电缆连接技术、高密度电子封装技术、 mfs热管理技术。
Coverage ranges from thermal properties and semiconductor materials to mosfets , digital logic families , memory devices , microprocessors , digital - to - analog and analog - to - digital converters , digital filters , and multichip module technology 覆盖范围从热性能和半导体材料的mosfet ，数字逻辑家庭，记忆体装置，微处理器，数位类比和模拟到数字转换器，数字滤波器，以及多芯片组件技术。
Multichip module ( mcm ) is high - level mode in electronic package . mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate . mcm can meet the demands of compact packaging and high density 多芯片组件( mcm )是微电子封装的高级形式，它是把裸芯片与微型元件组装在同一个高密度布线基板上，组成能够完成一定的功能的模块甚至子系统。
With the rapid development of integrate circuit and electronic products various packaging modes and packaging technologies are developed . multi - chip module ( mcm ) packaging technologies rapidly develop because of it ’ s characteristic of improving frequency and increasing transmission speed and so on 多芯片组件( multi - chipmodule即mcm )封装技术因组装密度高,改善了频率特性和传输速度等一系列优点获得了迅速发展。
And designed a program used by this method to design a filter . the result complies with the analytic result . at the end of this paper , according to the project of airline broadcast , the author designd filter with high rectangular factor , five channelizing filter banks , saw programmable correlator implemented with multiplayer muti - chip technology , saw resonator 本文的最后，结合某航空直扩数传电台的工程要求，设计了高矩形系数的前置滤波器、声表面波滤波器组、采用多芯片组装厚膜工艺技术的声表面波可编程相关器和声表面波压控振荡器，完成了解调解扩单元的硬件设计。
Being based on actual multi - chips module packaging structure a three dimensional thermal analysis model is built , thermal analysis on multi - chips module is conducted using diamond substrate and thermal interfacial materials ; a two dimensional and three dimensional chip - adhesive ? substrate thermal stress model are built , and interfacial thermal stress distributions are computed based on different area ratios and thickness ratios of substrate to chip 本文根据实际的多芯片组件的封装结构,建立了三维温度场分析模型,分析了金刚石作为导热层和基板对多芯片组件散热性能的改善;建立了二维和三维的芯片-粘结层-基板热力学模型,分析了不同的基板/芯片厚度比和面积比对层间热应力分布的影响。
