There are various techniques involved in the development of umbirfpa , such as principle of the device , micro - machined technique , readout integrated circuit ( roic ) , signal process , infrared imaging , device capsulation and so on Umbirfpa的研制涉及到器件原理研究、红外材料的研制、微机械制造技术、低功耗信号读出技术、信号处理技术、红外成像技术、器件封装技术等方面。
Much attention has been focused in recent years on the research of fbg sensor package technology and the temperature and strain separation method . these two issues are the key problems for good practical application of the fbg sensors 光纤布拉格光栅传感器的封装技术与测试结果中的应变/温度效应分离技术都是目前国内外研究的热点,也是光纤布拉格光栅传感器应用于实际工程结构的重要先决条件。
In chapter four , according to the demand of the platform , the distributed computing technique , legacy system ' s encapsulation technique , systematic integrated technique and other key enable technique are discussed . a solution to the platform is provided 第四章针对集成平台对技术需求，深入探讨分布计算技术、 legacy系统的封装技术和系统集成技术等关键使能技术，提出了集成平台的技术解决方案。
This thesis gives analysis on tdm circuit emulation structure in psn , describes the basic theory of tdmoip and the technology of encapsulation , based on which a applicable circuit emulation equipment application scheme 本论文对分组交换网中tdm电路仿真的体系结构进行了分析,描述了tdmoip的基本理论及适配、封装技术,在此基础上提出了一套可行的电路仿真设备实现方案。 tdmoip的技术依据是ietf的pwe3草案。
With the rapid development of integrate circuit and electronic products various packaging modes and packaging technologies are developed . multi - chip module ( mcm ) packaging technologies rapidly develop because of it ’ s characteristic of improving frequency and increasing transmission speed and so on 多芯片组件( multi - chipmodule即mcm )封装技术因组装密度高,改善了频率特性和传输速度等一系列优点获得了迅速发展。
The flip chip technology developed recently provides the shortest possible leads , lowest inductance , highest frequency , best noise control , highest packaging density , greatest number of inputs / outputs ( i / 0 ' s ) and lowest profile when compared with other popular interconnect technologies 新近发展起来的电子封装倒装焊技术，具有封装密度高、信号处理速度快、寄生电容/电感小等优点，是目前最具发展前景的先进封装技术之一。
The dissertation primarily researches on fbg , theoretically and experimentally analyses its sensing principle , high speed demodulation as well as packaging . the main content is : 1 . generally introducing the invention , development and present state of fiber grating sensing technique 本论文主要以光纤布拉格光栅为研究对象,对其传感技术、高速解调技术及封装技术进行了理论和实验的研究,主要内容包括: 1 、概况介绍了光纤光栅传感技术的出现、发展及现状。
We first analyze the corba and event service , and discuss the network management technologies , then we propose a distributed network management model based on corba and corba event service , at last we fulfill the ip accounting of network management by using snmp > corba and java technologies 最后利用已有的corba平台，结合网络管理协议snmp 、 corba技术及其事件服务、网关技术和本文提出的封装技术，采用面向对象语言java实现了本文提出的分布式网络管理模型中的计费管理功能的设计开发。
However , the disadvantage of laser welding is the so - called post - weld - shift ( pws ) . the end result is a reduction in light coupling efficiency . the shrinkage force generated by the solidification process is so great that no known mechanical structure can counteract the shrinkage from shifting the joint ? at least at the micron level 这种封装技术最大的缺点是会使激光二极管的封装产生焊后偏移( pws ) ,很少有一种机械的方法可以校正这种焊后偏移到亚微米级别,目前激光锤被证明是一种很有效的校正方法,激光锤校正作用过程就是利用金属熔化凝固冷却产生的内应力来恢复焊后偏移的过程。
Catalytic converter is one of the main countermeasures in controlling the automotive exhaust emission in the world . most of the gasoline engine of car and light duty truck have been installed the catalytic converter in the u . s . , japan and europe . from the review and analysis of a great number of foreign literatures , a set of evaluation technique and test method for reliability of automotive catalytic assembly has been set up 通过分析催化转化器载体和垫层的特性，提出了悬浮式垫层封装技术；并在在用车及新车催化转化器的开发中提出了用金属网催化转化器作为预起燃装置，同时采用陶瓷催化转化器的复合型结构设计，壳体采用悬浮式封装结构形式，催化剂采用稀土和贵金属复合型，台架试验及实车试验结果表明设计方案达到设计要求。
