混合集成电路

• Dielectric paste for multilayer lay out of thick film hybrid integrated circuits
  厚膜混合集成电路多层布线用介质浆料
• Hybrid integrated circuits detail specification for type hca2 charge amplifiers
  混合集成电路hca2型电荷放大器详细规范
• Film and hybrid integrated circuits - procedure for qualification approval
  薄膜集成电路和混合集成电路.合格鉴定批准程序
• Hybrid integrated circuits detail specification for type hmsf - 600 power filters
  混合集成电路hmsf - 600型电源滤波器详细规范
• Sectional specification : film and hybrid integrated circuits ; german version en 163100 : 1991
  分规范.薄膜集成电路和混合集成电路
• Development of hybrid integrated circuit of high linearphase - locked frequency discriminator
  混合集成电路高线性锁相鉴频模块的研制
• Hybrid integrated circuits detail specification for type hdcd2812d15 dc dc converters
  混合集成电路hdcd2812d15型dc dc变换器详细规范
• Film and hybrid integrated circuits - internal visual inspection and special tests
  薄膜集成电路和混合集成电路.内部目视检验和专用试验
• Hybrid integrated circuits detail specification for type hpa2753 pwm power amplifiers
  混合集成电路. hpa2753脉宽调制功率放大器详细规范
• Blank detail specification : film and hybrid integrated circuits ; german version en 163101 : 1991
  空白详细规范.薄膜集成电路和混合集成电路