Film and hybrid integrated circuits - part 4 : customer information , product assessment level schedules and blank detail specification ; german version en 165000 - 4 : 1996 薄膜和混合集成电路.第4部分:客户信息产品评估等级
At the moment , most of rf chips and ultra high - speed circuits are based on technologies such as gaas , bipolar si , bicmos and so on 标准cmos工艺作为数模混合集成电路的主流工艺,随着cmos技术的发展,具有广泛的市场前景。
Semiconductor devices - integrated circuits - hybrid integrated circuits and film structures - manufacturing line certification - blank detail specification 半导体器件.集成电路.混合集成电路和薄膜结构.生产线认证.空白详细规范
So starting the hic reliability analysis , taking effective actions , improving the products ' reliability are very instructive 因此，开展对厚膜混合集成电路可靠性分析工作，采取有效措施，提高其自身的可靠性具有非常重要的意义。
Specification for harmonized system of quality assessment for electronic components - blank detail specification : film and hybrid integrated circuits capability approval 电子元器件用质量评估协调体系.空白详细规范.薄膜混合集成电路
Our company develops advanced function devices including hybrid integrated circuits , power integrated circuits and dc dc converters for communications equipment 开发混合集成电路功率集成电路和通信器材用dc dc转换器等高性能器件。
Semiconductor devices . harmonized system of quality assessment for electronic components . film and hybrid integrated circuits . sectional specification . specification cecc 63 100 半导体器件.电子元件统一质量评定体系.薄膜混合集成电路.分规范
Semiconductor devices - integrated circuits - hybrid integrated circuits and film structures - manufacturing line certification - procedure for qualification approval 半导体器件.集成电路.第23 - 5部分:混合集成电路和薄膜结构.生产线认证.合格鉴定规程
Semiconductor devices . harmonized system of quality assessment for electronic components . film and hybrid integrated circuits . blank detail specification . specification cecc 63 101 半导体器件.电子元件统一质量评定体系.薄膜混合集成电路.空白详细规范
