silicon造句

• Now people can produce a wafer silicon .
  现在人们能够生产一种硅晶薄片。
• Silicon is usually added by co-evaporation .
  硅通常是通过共蒸发来加入的。
• Total silicon loss can equal 50% at this step .
  在这阶段总的硅损失量达50。
• What uses will they find for a silicon chip ?
  他们将为硅片找到什么样的用途？
• Silicon is one of the most studied elements in the periodic table .
  硅是周期表中最熟悉的元素之一。
• The pertinent siloxane compounds contain two silicon hydride bonds .
  所说的硅氧烷组合物中，含有两类硅氧键。
• The pertinent siloxane compounds contain two silicon hydride bonds .
  所说的硅氧烷化合物中，含有两类硅氧键。
• Inside the battery there are a number of disk made of the element silicon .
  在电池内部，有一些用硅元素做成的圆盘。
• The cell contains two types of silicon spheres about as big as buckshot .
  这种电池装有两种大约有头号铅弹那样大的硅球。
• This dependence may be the result of phosphorous being segregated into the silicon .
  这种依赖性可能是磷分凝在硅中的结果。
• The method is to coat a wafer of silicon with a protective layer of silicon dioxide .
  其方法是往硅片上涂上一层二氧化硅防护膜。
• Normal glass will slough off silicon that may stimulate high levels of production .
  普通玻璃可能会使刺激高水平生产量的硅脱落。
• Silicon is a hard, brittle material registering 72. 6 on the rockwell "a" hardness scale .
  硅是硬而脆的材料，根据Rockwell“A”硬度分度测值为726。
• The processing characteristics and some material properties of silicon wafers depend on the orientation .
  硅片的工艺性质与某些材料特性均与晶向有关。
• Doped silicon and germanium are technologically the most important types of semiconducting material .
  添加硅和锗在工艺上是半导体物质中最重要的类型。
• Silicon and germanium, for instance, have forbidden bands whose widths are 1. 1 and 0. 65ev, respectively .
  例如，硅和锗的禁带宽度分别为11电子伏和065电子伏。
• Upon cooling, the thermal mismatch between residual silicon and quartz usually results in the fracture of the crucible .
  当冷却时，残余的硅和石英间的热失配往往导致坩埚破裂。
• A way to circumvent the problem is to fabricate devices in small islands of silicon on an insulating substrate as shown in fig. 32 .
  消除这个问题的一个方法是把器件制造在绝缘衬底的硅岛上，如图32所示。
• The final ic is made by sequentially transferring the features from each mask, level by level, to the surface of the silicon wafer .
  按照顺序从每一块掩膜版上将图形一层一层地转移到硅片的表面，就制得了成品集成电路。
• Lithography, as used in the manufacture of ics, is the process of transferring geometic shapes on a mask to the surface of a silicon wafer .
  光刻技术应用到集成电路制造中，就是将掩模版的几何图形转移到硅片表面的工艺过程。