制造缺陷的英文

• manufacturing defect
• manufacturing deficiency
• operational defect

• "制造"英文翻译    make; manufacture; produce
• "缺陷"英文翻译    defect; flaw
• "制造缺陷分析程序" 英文翻译 :    manufacturing defects analyzer
• "制造缺陷分析程序（分析器）" 英文翻译 :    manufacturing defects analyzer
• "装备制造缺陷引起的故障" 英文翻译 :    materiel failure
• "抬芯(铸造缺陷)" 英文翻译 :    core raise
• "铸疵, 铸造缺陷" 英文翻译 :    foundry defects
• "铸疵，铸造缺陷" 英文翻译 :    foundry defects
• "铸造缺陷" 英文翻译 :    casting defect; casting fault; casting flaw; flaw in casting; foundry defect
• "对坏故障或制造缺陷有一年保修的钟" 英文翻译 :    a clock guaranteed for one year against mechanical failure or faulty workmanship
• "木材构造缺陷" 英文翻译 :    defects of wood structure
• "有铸造缺陷的硬币" 英文翻译 :    fido
• "构造缺失" 英文翻译 :    structural deficiency
• "缺陷" 英文翻译 :    defect; fault; faultiness; vitium; lesion; flaw; disorder; imperfection; drawback; blemish
• "制造" 英文翻译 :    makemanufactureproduce
• "c1缺陷" 英文翻译 :    c1 deficiency
• "c2缺陷" 英文翻译 :    c2 deficiency
• "c3缺陷" 英文翻译 :    c3 deficiency
• "c4缺陷" 英文翻译 :    c4 deficiency
• "c5缺陷" 英文翻译 :    c5 deficiency
• "c6缺陷" 英文翻译 :    c6 deficiency
• "c8缺陷" 英文翻译 :    c8 deficiency
• "点缺陷" 英文翻译 :    point defect; point imperfection; pointdefect; pointimperfection; spot defect
• "钢缺陷" 英文翻译 :    steel defect
• "光缺陷" 英文翻译 :    optical defect

• Tweezer arrays with dozens of beams could manipulate particles to create defects in an ordered colloidal crystal
  光钳阵列的数十道光束可以操控粒子，在井然有序的胶态晶体上制造缺陷。
• Solder shorts are a common manufacturing defect , and you must find them before proceeding with the component tests
  焊接导致短路是很普遍的制造缺陷，必须在器件测试开始之前发现这一问题。
• In - circuit testers can now also test for solder opens on surface - mounted devices ( smds ) , a common manufacturing defect on boards with smds
  对于表面安装设备来说，焊接开路是一个很普遍的制造缺陷，在线测试设备可以将其测试出来。
• Today , the test engineer has many more options , including in - circuit testers , manufacturing defects analyzers , and several types of functional testers
  今天，测试工程师有很多选择，包括在线测试设备，制造缺陷分析设备和一些功能测试设备。
• This thesis aims at discussing the model of manufacturing defects , the principles of soft and hard faults induced by manufacturing defects , the effects of soft fault on circuit reliability and yield and the relationship between yield loss and reliability decrease caused by manufacturing defects . the author ' s main contributions are as following : reliability and yield are two significant factors to semiconductor manufacture . based on the principles of the manufacturability engineering , the thesis discusses the effects of the manufacturing defect on the functional yield , parametric yield and the reliability for ics , and abstracts geometric models from actual chips
  本文对集成电路制造缺陷模型、由制造缺陷导致的软、硬故障的作用机理、软故障对电路可靠性和成品率的影响以及由制造缺陷导致的电路成品率的损失和可靠性下降之间的关系进行了系统的研究，主要研究结果如下：可靠性和成品率是影响半导体生产的两个主要因素，本文首先从集成电路的可制造性工程理论出发，讨论了制造缺陷在影响集成电路功能成品率、参数成品率和可靠性方面的作用。
• The defect of products is a element of product liability . in one hand it concerns that if the harmed consumers can be remedied and hi another hand , to determine and classify the defect of products properly is a key step of balancing duty . there are three standards relating to defect of products : subjective standard , objective standard , mixed standard . the author considers that the mixed standard is rather available . defect can be classified into three kinds : designing defect , alerting defect , producing defect . according to the definitation , there are three conditions to determine designing defectthere exists foreseeable danger in products when products are sold ; there may exist alternative resonable design ; the alternative design can reduce or dissolve defect of product . the standard is beneficial for producers . the part also rethinks the rules related to the standard of products defect
  缺陷可分为三类：设计缺陷、警示缺陷和制造缺陷。 《美国侵权行为法第三次重述产品责任》对设计缺陷和警示缺陷的定义作了调整值得注意。依照这一定义，设计缺陷认定需要三个条件：产品在投入流通时存在可预见的致损风险；可能存在针对该产品缺陷的合理替代设计；合理替代设计可以减少或消除该致损风险。