封装元件的英文

• encapsulated component
• potted element

• "封装"英文翻译    package; potting; encapsulat ...
• "元件"英文翻译    element; component; part; ce ...
• "无封装元件" 英文翻译 :    uncased component
• "表面安装元件" 英文翻译 :    smc surface mount component; surface-mounted device (smd)
• "表面安装元件布局机" 英文翻译 :    surface mount component placement machine
• "无引线表面组装元件" 英文翻译 :    leadless surface mount component
• "有引线表面组装元件" 英文翻译 :    leaded surface mount component
• "片状元件封装" 英文翻译 :    sealing of chicomponent
• "元件封装总结" 英文翻译 :    protel
• "元件封装的改变" 英文翻译 :    different footprints
• "封装" 英文翻译 :    [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; packaging
• "包装元素" 英文翻译 :    wrapper element
• "元件" 英文翻译 :    [电工] element; component; part; cell; organ 传输元件 transfer element; 电光元件 electrooptic cell; 电路元件 circuit component; 敏感元件 sensor
• "表面安装元器件" 英文翻译 :    surface mount device
• "表面组装元器件" 英文翻译 :    surface mount component
• "internet封装" 英文翻译 :    internet packages
• "段封装" 英文翻译 :    segment package
• "封装，组装" 英文翻译 :    packaging
• "封装的" 英文翻译 :    housed; potted
• "封装盒" 英文翻译 :    pentium2cpu
• "封装机" 英文翻译 :    packaging machine; sealing machine
• "封装胶" 英文翻译 :    blocking cement
• "封装类" 英文翻译 :    capsuleclasss
• "封装片" 英文翻译 :    case chip
• "封装器" 英文翻译 :    packetizer; tcp wrapper; wrapper

• The design of temperature sensor realizes bare fiber temperature characters and strain insensitivity of capsulated components in the range of 30 ~ 85 , which guarantees their high stability and repeatability
  温度传感器的设计结构在30 ? 85的温度变化范围内有效的实现了封装元件的裸删温度特性及应变不敏感性,保证了其高稳定性和重复性。
• Several materials with large coefficient of expansion were selected to make packaging components , and it was found that the packaging materials have good temperature sensitivity and compatibility with optical fibers . experimental accuracy and repetition of fbg temperature sensitivity and compensation were discussed . have selected several materials which has bigger coefficient of expansion to do packaging components , have made many temperature experiments , there have not flaws , such as aging , crackle , absciss layer , packaging materials have good temperature sensitivity and compatibility with optical fiber ; have designed the simple and practical packaging components , have performed a serials of experiments about accuracy and repetition of fbg wave - length , have obtained the first step conclusion ; have analyzed the result and made comparison between the result of different experiment , have summarized the best packaging effect and several rules to reduce mistskes
  本文所做的主要工作包括以下几个内容：一、选取了常见的热膨胀系数大的材料制作封装元件，经过多次一80到80反复测试，封装元件没有出现老化开裂、封装裂纹、空洞、离层等缺陷，封装材料具有良好的温敏稳定性及复用性，与光纤相容性较好；二、对光纤光栅进行简单、实用的封装处理，就封装效果的优劣性、波长测量的准确度、重复性和封装时产生的波长损失等方面进行了一系列的实验，得出了初步的结论；三、对温敏和温度补偿式封装的实验数据进行了详细的分析和对比，从数字上对温变过程中光纤光栅中心波长的改变及温变曲线进行了定量的分析，在大量实验数据分析结果的基础上，总结出哪种材料封装效果更好，以及如何有效的减小实验误差。