润湿平衡法的英文
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"润湿平衡法"怎么读用"润湿平衡法"造句
英文翻译手机版
- wetting balance
- "润湿"英文翻译 madefaction; wetting
- "平衡法"英文翻译 balancing method; balanced m ...
- "润湿平衡" 英文翻译 : wettability equilibrium
- "润湿平衡能" 英文翻译 : equilibrium energy of wetting
- "吸湿平衡" 英文翻译 : moisture equilibrium at dry side; moisture sorption equilibrium
- "平衡法" 英文翻译 : balance method; balanced method; balancing method; counterbalanced procedure; equilibrium method; law of equity; leveling method; method of equilibrium; null readings; zero method
- "沉降平衡法" 英文翻译 : sedimentation equilibrium method
- "冲淤平衡法" 英文翻译 : regime approach; regime method
- "等分平衡法" 英文翻译 : method of making the rock equa-tional and balanced
- "低平衡法" 英文翻译 : harmonic balance method; method of harmonic balance
- "电流平衡法" 英文翻译 : current-balance method
- "电位平衡法" 英文翻译 : potentiometer balanced ethods; potentiometer balanced methods for magnesium
- "电压平衡法" 英文翻译 : voltage balance method
- "反平衡法" 英文翻译 : counter balancing method
- "反热平衡法" 英文翻译 : heat balance by indirect method
- "非平衡法" 英文翻译 : imbalance method
- "风量平衡法" 英文翻译 : balanced capacity
- "光平衡法" 英文翻译 : optical null method
- "极限平衡法" 英文翻译 : limit equilibrium method; method of limit equilibrium
- "快速平衡法" 英文翻译 : coatings-flash point test-rapid equilibrium method
- "零平衡法" 英文翻译 : null balance method; null-balance method
- "能量平衡法" 英文翻译 : energy budget method; energy-balance method; engine budget method
- "扭矩平衡法" 英文翻译 : torque-balance system
- "平衡法测量" 英文翻译 : null measurement
- "平衡法抵押" 英文翻译 : equitable mortgage
例句与用法
- Environmental testing . part 2 : tests . test ta : soldering . solderability testing by the wetting balance method
基本环境试验规程.第2部分:试验.第54节:试验ta :锡焊.润湿平衡法可焊性试验 - Solder wire , solid and flux cored - specification and test methods - wetting balance test method for flux core solder wire efficacy
实心和管状钎料焊丝.规范和试验方法.管状钎料焊丝效能的润湿平衡法 - Solder wire , solid and flux cored - specifications and tests methods - part 3 : wetting balance test method for flux cored solder wire efficacy
实心和管状钎料焊丝.规范和试验方法.第3部分:管状钎料焊丝效能的润湿平衡法 - Environmental testing - part 2 : tests - test te : solderability testing of electronic components for surface mount technology by the wetting balance method
基本环境试验规程.第2部分:试验.第69节:试验te :润湿平衡法对表面镶嵌技术用电子元件的软钎焊试验 - Environmental testing - test methods - tests - test te - solderability testing of electronic components for surface mount technology by the wetting balance method
环境试验规程.第2部分:试验方法.第69节:试验te :润湿平衡法试验表面镶嵌技术用电子元件软钎焊
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