玻璃封装的英文
发音:
"玻璃封装"怎么读用"玻璃封装"造句
英文翻译手机版
- glass encapsulative
- glass envelope
- glass package
- glass sealing
- "玻璃"英文翻译 glass
- "封装"英文翻译 package; potting; encapsulat ...
- "玻璃封装剂" 英文翻译 : glass encapsulant
- "全玻璃封装" 英文翻译 : overglassing
- "玻璃封装专用设备" 英文翻译 : gla sealing-packing equipment; glass sealing-packing equipment
- "全玻璃覆盖,全玻璃封装" 英文翻译 : overglassing
- "玻璃封边" 英文翻译 : glazing gasket
- "玻璃封接" 英文翻译 : glass pinch; glass sealing
- "玻璃封接的" 英文翻译 : glass-sealed
- "玻璃封口" 英文翻译 : glass seal; glass-dead seal
- "玻璃封套" 英文翻译 : glass envelope
- "铜玻璃封接" 英文翻译 : copper-to-glass
- "玻璃封接合金" 英文翻译 : glass sealing alloy
- "铜与玻璃封焊" 英文翻译 : copper glass seal; copper-glass seal
- "玻璃封边;玻璃镶边" 英文翻译 : glazing gasket
- "玻璃与玻璃封接" 英文翻译 : glass-to-glass sealing
- "玻璃封接的晶体管" 英文翻译 : glass sealed transistor
- "玻璃封接电阴器" 英文翻译 : glass sealed resistor
- "玻璃封接晶体管" 英文翻译 : glass sealed transistor
- "玻璃封接式晶体管" 英文翻译 : glass seal type transistor
- "玻璃封接温度计" 英文翻译 : gla sealed thermometer; glass sealed thermometer
- "低熔点玻璃封接" 英文翻译 : frit seal
- "玻璃封裹铂铱热导检测器" 英文翻译 : glass-clad platinumiridium thermal conductivity detector
- "玻璃封接用低熔点合金" 英文翻译 : glass cementing alloy
- "铁镍钴玻璃封接合金" 英文翻译 : fe-ni-co glass sealing alloy
例句与用法
- Test method for embedment stress caused by casting compounds on glass - encased electronic components
玻璃封装电子器件受浇铸化合物所引起的灌封应力的试验方法 - It is with complete cell packing structure , good glass sealing , flat end face internal leads , and dense gloss of coating
管壳结构完整、玻璃封装良好,内引线端面平整,镀层光泽致密。 - Detail specification for general purpose silicon signal diodes - 150 ma , 150 v , hermetically sealed , glass encapsulation - general application category q
通用硅信号二极管详细规范. 150ma 150v密封玻璃封装.一般应用范围q - The element of the pe , ceramic package and glass package circuit are mostly introduced , and the infection of saltfog test for them in theory is analysed
摘要主要讲述了塑封电路、陶封电路和玻璃封装电路的成分,并对盐雾试验对它们的影响进行了理论分析。 - This model is manufactured by applying the technique combining ceramic process and semicorductor process , featuring an enclosed glass structure with axial leadout at both ends
本型号产品采用陶瓷工艺与半导体工艺相结合的工艺技术制作而成,为两端轴向引出线玻璃封装结构。
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