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电介质材料的英文

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"电介质材料"怎么读用"电介质材料"造句

英文翻译手机手机版

  • dielectric material
  • dielectric substance

例句与用法

  • Measurement of complex permittivity of dielectric materials at microwave frequencies
    微波电介质材料复介电常数的扫频测量
  • Test method for complex permittivity of solid dielectric materials at millimeter wave frequencies using " quasi - optic cavity " technique
    毫米波频段固体电介质材料介电特性测试方法准光腔法
  • The ctc series chip capacitor has much lower esr and esl than most leaded type capacitor and lts lower dissipation factor leads to lower power is wasted than aluminum electrolytic and tantalum capacitors
    Ctc系列电介质材料有: npo , x7r , y5v , z5u ctc系列与大多数引线电容相比有更低的esr和esl ,低损耗特性使它比铝电解电容和钽电容更省电。
  • The thesis mainly investigated the bati _ 4o _ 9 ( bt _ 4 ) , which has the lowest dielectric loss in ba - ti system , and ( ba , sr ) tio _ 3 , the a position substitute compound of batio _ 3 . the dielectric properties of bt _ 4 / bst with different preparation way and different elements doping were investigated . a archimedes method , xrd , sem , impedance analyzer , network analyzer and hakki - coleman method were used to investigate the density , phase formation , microstructure , dielectric properties and doping mechanisms
    本论文以在ba - ti系中具有最低介电损耗的bati _ 4o _ 9 ( bt _ 4 )高频介质陶瓷和batio _ 3a位sr取代而得的( ba , sr ) tio _ 3 ( bst )高频介质陶瓷作为研究对象,对不同粉体制备方法制备的bt _ 4 / bst高频电介质材料进行不同元素的掺杂,运用阿基米德方法, x射线衍射分析仪,扫描电子显微镜和阻抗分析仪,网络分析仪, hakki - coleman法等方法手段和测试仪器测试烧成样品的密度,相组成情况,微观结构和介电性能,探讨造成介电性能起伏的形成机理。
  • Tio _ 2 has been known as an n - type metal oxide semiconductor and an important inorganic function material . it can be used in fabricating medium material , photocatalytic films , reducing reflect coat , gas sensor , etc . tio _ 2 films had excellent performance with photocatalysis , resisting photo erode , difficult dissolution in acidity condition , innocuity and stabilization in light and soon on
    Tio _ 2是n型金属氧化物半导体,是一种重要的无机功能材料,可用于制作电介质材料、光催化薄膜、减反射涂层、气敏传感器等。 tio _ 2薄膜具有优异的光催化性能,抗光腐蚀,在酸性条件下难溶,对光稳定,无毒等。
  • The development of filters , resonators and other telecommunication technology required better dielectric materials . the dielectric materials , used as the resonate body , should be high in dielectric constant , low in dielectric loss and a near zero temperature coefficient of dielectric constant in high frequency band , also could be sintered in a relative low temperature so as to reduce production cost , and what ’ s more , the miniaturization and reliability of materials are also the main aspects in the research work of high frequency band dielectric materials
    随着滤波器、谐振器等器件以及通信技术的发展,人们对电介质材料的要求越来越高,要求作为介质谐振腔的电介质材料在高频段下具有高介电常数,低介电损耗,接近于零的介电常数温度系数,还要求高频电介质材料能够在较低的烧结温度下烧成,以降低实际生产的成本,此外,材料的小型化,高可靠性也是高技术高频介质材料的重要研究方向。
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