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电子气的英文

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"电子气"怎么读用"电子气"造句

英文翻译手机手机版

  • electron fluid
  • electron gas

例句与用法

  • Progress in two - dimensional electron gas in group - - nitride heterostructures
    族氮化物异质结构二维电子气研究进展
  • Influence of al composition on transport properties of two - dimensional electron gas in alx ga1 - x n gan heterostructures
    异质结构中二维电子气输运性质的影响
  • Influence of polarizations and doping in algan barrier on the two - dimensional electron - gas in algan gan heterostruture
    异质结构中极化与势垒层掺杂对二维电子气的影响
  • In this dissertation , we study the quantized conductance phenomena on the experimental side and obtain the physical parameters of the 2deg in our samples
    在这论文中,我们在实验方面研究了电导量子化的现象,并且得到我们样品之二维电子气的基本特性。
  • Recently , the interaction between saw and the 2deg in the gaas / alxga1 - xas heterojunction has attracted more and more scientists " attentions
    近年来,表面声波( saw )通过压电效应与gaas / alxga1 - xas异质结中二维电子气( 2deg )的相互作用受到越来越多的关注。
  • Under high drain voltage condition , the results proved that channel electrons are easily ejected into gan buffer layer and be trapped to induce current collapse
    在大漏极电压条件下,沟道电子易于注入到gan缓冲层中,并被缓冲层中的陷阱所俘获,耗尽二维电子气,从而导致电流崩塌效应。
  • Based on gan hemt device physics and experiment results , we found electron mobility is depend on sheet density of 2deg and proposed a new gan hemt current collapse physical model
    基于ganhemt器件物理和实验分析测试结果,发现电子迁移率与二维电子气浓度有关,并提出了一种gan电流崩塌效应的新物理模型。
  • This model described relationship of current collapse and traps in buffer layer , and the normalized product of electron mobility and 2deg density with and without current collapses was 0 . 95 vgs
    该模型描述了电流崩塌效应与缓冲层中陷阱的相互关系,并获得了电流崩塌前后迁移率与二维电子气浓度乘积的归一化值0 . 95 vgs 。
  • By the use of iteration method to solve schrodinger - poisson equations when algan barrier layer doped about 1 1018cm - 3 , the max sheet density of 2deg is 1 1012cm - 2 and the thickness of 2deg is increasing from 15nm to 40nm with barrier ’ s thickness increasing
    采用迭代法求解schrodinger - poisson方程,当algan势垒层掺杂浓度为1 1018cm - 3时,二维电子气浓度最高可达1 1012cm - 2 ,并且二维电子气薄层厚度随着势垒层厚度的增加从15nm增加到40nm 。
  • However , in our nation , the research on gan - based microelectronic devices is in the early stage , and a great deal of vestigation is still needed to perform on separative processes of gan devices . due to the lack of algan / gan heterojunction materials in the country , a few researches on algan / gan were made , and the investigation on schottky rectifiers is much less
    在国内, gan基微电子器件的研究刚开始起步,制备gan分立器件的工艺尚处于探索研究阶段,特别是受algan gan二维电子气材料来源的限制,国内algan gan基的场效应晶体管的研究开展得较少,关于肖特基整流二极管的研究更少。
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