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硅层的英文

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"硅层"怎么读用"硅层"造句

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  • silica

例句与用法

  • Bonded wafers - two silicon wafers that have been bonded together by silicon dioxide , which acts as an insulating layer
    绑定晶圆片-两个二过通片圆晶氧化硅层结合到一起,作为绝缘层。
  • In light of them , matching pmosfet and nmosfet with strained si channel were designed . 2 . the epitaxy layers including lt ( low temperature ) si grow technicsare discussed
    2 .研究了包括400下分子束外延法生长100nm的低温硅层的各外延层生长技术。
  • Up to present we have prepared the epitaxial simox substrate ( i layer 0 . 37um , silicon layer 2 . 8um ) , and done the circuit design , process integration , device simulation and some layout design )
    本项目目前已完成了simox外延衬底的制备( i层0 . 37um ,外延硅层2 . 8um ) ,以及功率开关集成电路的电路设计,工艺设计和部分版图设计。
  • It also has short protection and voltage overshot protection block . devices and ics based on esoi have the advantages of not only cheaper substrate , good performance of soi technology , but also obtaining a certain breakdown voltage and optimization of self - heating effect
    基于esoi的器件及集成电路不仅衬底材料制备工艺简单,硅层厚度均匀性好,器件及电路特性具有soi结构的优点,而且还兼顾一定的耐压,对自加热效应也得到优化。
  • Ps radiation mechanism has been discussed and investigated for many years and many theoretical models have been proposed to describe photoluminescence in porous silicon , for instance quantum confinement effect model , polysilanes model , siloxen and its derivant , surfacial states model and quantum confinement - light center model etc . in addition , study status of ps at present is addressed and applied problems in some fields are analyzed in this section
    多年来,人们对多孔硅发光机理一直进行着坚持不懈的探讨和研究,提出了许多种解释多孔硅层( psl )发光的模型,典型的有下列几种:量子限制模型、硅-氢键或多硅烷( polysilanes )的发光、硅氧烯及其衍生物的发光、表面态模型和量子限制-发光中心模型。
  • After structure design aimed to high transconductance , parameters of device structure are modified in detail . the simulation results of soi nmos with strained si channel show great enhancements in drain current , effective mobility ( 74 % ) and transconductance ( 50 % ) beyond conventional bulk si soi nmosfet . the strained - soi nmosfet fabrication process is proposed with lt - si ( low temperature - si ) technology for relaxed sige layer and simox technology for buried oxide
    其次,根据器件参量对阈值电压和输出特性的影响,以提高器件的跨导和电流驱动能力为目的设计了strained - soimosfet器件结构,详细分析栅极类型和栅氧化层厚度、应变硅层厚度、 ge组分、埋氧层深度和厚度以及掺杂浓度的取值,对器件进行优化设计。
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