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离子源的的英文

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"离子源的"怎么读用"离子源的"造句

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  • ionogenic

例句与用法

  • Characteristics of rf ion source electromagnetic field
    型放电离子源的场特性
  • Construction of electrostatic accelerator rf ion source
    用于静电加速器的高频离子源的设计和调试
  • The theory of ion etching and the parameter of ion source designing are discussed in detail
    并且详细介绍了离子刻蚀和离子源的原理。
  • We suggest that optimization of the tip geometry considerably improve the performance of the liquid metal ion source
    从而为液态金属离子源的设计提供了一个有效的辅助工具。
  • Various factors , including the apex geometry of the emitter tip , the protrusion length , and the simulated charge distribution , were considered
    因而对其发射系统进行仿真分析,可以很好地指导液态金属离子源的设计制造。
  • Electric field of the emission system of a liquid metal ion source was simulated , based on the conventional dynamic protrusion model and the widely used charge simulation method
    摘要发射系统是液态金属离子源的关键部件之一,它的性能的优劣直接影响到整个离子源的工作稳定性和可靠性。
  • ( 4 ) chapter vi . the theory of ion curren extraction of rf ion source is investigated , the reason of emission surface formation and its effect on ion curren extraction are reasearched emphatically
    ( 4 )对高频离子源的束流引出原理作了理论推导和分析,着重研究了发射面的形成及其对引出束流特性的影响。
  • The conclusion that ez is more important during the breakdown of rf ion source is made out by comparing ez and e 6 before breakdown , and then , the breakdown criterion of rf ion source is deduced , and the relation between breakdown voltage and pressure is analyzed too
    通过比较击穿前高频电场的轴向和幅向分量,得出了轴向电场在高频离子源击穿中起主要作用的结论,并进而推导出了高频离子源的击穿判据,得出了气体击穿时离子源击穿电压和放电管内气压的关系。
  • In this thesis , we research the characters on the ion beam sputtering system , and prepare tiny films and cnx / tiny multilayers by ion beam sputtering . the best parameters of preparing cnx films are explored . we use the tiny films as template to promote the growth of cnx films
    本文对离子源的溅射特性进行了研究,采用离子束溅射法制备了tin _ y单层薄膜和cn _ x tin _ y多层薄膜,探索该法制备cn _ x薄膜的最佳工艺参数,并利用tin _ y薄膜为衬底以促进cn _ x薄膜的生长。
  • The theory of ion - beam etching and ion sources are reviewed . the classification of ion - beam etching are introduced . according to the mechanism that ion sputtering leads to faceting , trenching , reflection and redeposition , some relative solutions are put forward
    综合叙述了离子束刻蚀技术和离子源的工作原理,简单介绍了离子束刻蚀的分类,阐述了离子束刻蚀的物理溅射效应导致的刻面,开槽,再沉积等现象的产生机理及解决办法,分析了kaufman离子源进行ribe的可行性及出现的问题。
  • 更多例句:  1  2
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