表面划伤的英文

• surface tears

• "表面"英文翻译    surface; superficies; bounda ...
• "划"英文翻译    delimit; differentiate
• "伤"英文翻译    wound; injury
• "深冲表面划伤" 英文翻译 :    scuffing
• "汽缸工作面划伤" 英文翻译 :    scuffing of cylinder bore
• "表面划痕" 英文翻译 :    surface scratch
• "表面划痕试验" 英文翻译 :    surface scratching test
• "表面划痕硬度" 英文翻译 :    surface scratching hardness
• "表面划线培养" 英文翻译 :    surface streak cultivation
• "砂芯表面划痕" 英文翻译 :    core hardness
• "马氏表面划痕试验" 英文翻译 :    martens surfac scratching test; martens surface scratching test
• "划伤" 英文翻译 :    abrasion; fish tail; scar; score, scratch; scoring; scuffing; tear
• "马登斯表面划痕硬度" 英文翻译 :    marten hardness; marten surface scratching hardness
• "马登斯表面划痕硬度试验" 英文翻译 :    martens test
• "马登斯表面划痕硬度值" 英文翻译 :    martens hardness number
• "不允许有划伤碰伤等表面缺陷" 英文翻译 :    scratch or collision damages on the surface are not allowed
• "防划伤" 英文翻译 :    hard coat; scratch proof
• "抗划伤" 英文翻译 :    scratch resistance
• "轻划伤" 英文翻译 :    fine scratch; finescratch
• "地面划线图" 英文翻译 :    floor diagram
• "路面划线机" 英文翻译 :    road line machine; road marker; white line machine
• "水面划割" 英文翻译 :    surface piercing; surfacepiercing
• "在下面划线" 英文翻译 :    underline
• "暗盒划伤" 英文翻译 :    cassette scratches
• "磁带划伤" 英文翻译 :    tape scratch; tape-scratch

• By analyzing the reason of producing scratches , the fault model of the canopy glass is set up , and the fault - forecasting method for the scratch on the surface of
  从划伤的产生原因着手进行分析,建立了座舱玻璃划伤故障模型,提出了座舱玻璃表面划伤故障预制方法。
• Apply the product on the cd / dvd scratches , and use soft and clean cloth or silk or special cleaning cloth to treat the scratches according to relevant requirements , then the scratches on the optical disks can be repaired
  将本品于涂于cd / dvd光盘表面划伤处，使用柔软清洁的布、丝绸或专用清洁布用力对划伤区按使用要求处理，即可以修复光盘划痕。
• There exist large stress , intensive scratch , damage and pollution of ion in wafer process , so it is necessary to improve mechanism of slicing and lapping by changing single mechanical function to equilibrium chemical and mechanical function for small damage and low stress . reducing damage and stress and enhancing quality and efficiency of product result in a base of followed process so as to improve wafer process and enhance finished product ratio of whole wafer process
  目前加工过程中存在应力过大，造成表面划伤严重，容易产生破损，离子沾污的问题，因而必须改善切削、研磨机理，把单一的机械作用变为均匀稳定的化学机械作用，以达到浅损伤、低应力的目的，有效的减少破损层和应力的累积，提高产品质量和加工的效率。