贴片机的英文

• chimounter
• juki

• "贴"英文翻译    stick; paste; glue
• "片"英文翻译    a flat,thin piece; slice; fl ...
• "机"英文翻译    machine; engine
• "富士贴片机" 英文翻译 :    fuji
• "环球贴片机" 英文翻译 :    universal
• "三星贴片机" 英文翻译 :    samsung
• "松下贴片机" 英文翻译 :    panasonic
• "未来贴片机" 英文翻译 :    mirae
• "自动贴片机" 英文翻译 :    automatic coreslice adhering machines
• "安必昂贴片机" 英文翻译 :    assembleon
• "西门子贴片机" 英文翻译 :    siemens
• "雅马哈贴片机" 英文翻译 :    yamaha
• "贴片" 英文翻译 :    paster; patch; picking; stammounting paper; tabellae adhaesivus
• "全新系列贴片机中国总代理" 英文翻译 :    wkk
• "后贴片" 英文翻译 :    back statoo high; back stay; bak stay
• "角贴片" 英文翻译 :    butt chock
• "贴片袋" 英文翻译 :    bag
• "贴片化" 英文翻译 :    surface mounting technology smt
• "贴片宽" 英文翻译 :    decorastive woven patch width
• "贴片线" 英文翻译 :    smt line
• "粘贴片" 英文翻译 :    muco-adhesive tablets
• "不干胶贴片" 英文翻译 :    sticker
• "船尾柱贴片" 英文翻译 :    false stern post
• "地砖贴片" 英文翻译 :    pebbles tile
• "发热贴片" 英文翻译 :    exothermic padding

• Modular high speed placement machine - panasonic cm402
  模块化超高速贴片机panasonic cm402
• 1 years smt working experience universal pick and place machine
  1年以上smt行业工作经验(环球贴片机操作、检验、焊接) 。
• We has own painting workshop , assembly workshop , smt machine , so we can meet
  工厂有自己的喷油车间，装配车间， smt贴片机，能
• This product design for ic assembly die bonding process on die bonder machine
  本产品是为ic封装自动贴片机及其贴片工艺而设计。
• Lead free procedure panasonic module super hi - speed mounting machine assembly line x 3
  无铅制程的松下模块化高速贴片机生产线x 3
• Ntenna , ect . outdoor and indoor . we have also advantages whether on the prices or quality
  有38台多美国k s全自动半自动球焊机和贴片机。
• The experiment results demonstrate that the proposed algorithm enhances the precision of edge detection and satisfies the requirement of vision detecting in smc ( surface mounting machine ) mounting
  通过实验比较，认为该方法提高了边缘提取的精度，满足了贴片机视觉检测的要求。
• For the problem of feeder assignment , a new model for optimization is presented , which directly takes the total time spent to assembly the whole pcb as its objective , supposing the assembly sequence is already known
  摘要针对贴片机喂料器的分配问题，给出一个新的模型，在贴装顺序已知的前提下，以贴装整块电路板所花费的总时间作为优化目标。
• In this thesis , the work on automatic alignment system is as follows : firstly , after the methods and optical systems for alignment whose are used commonly now are discussed , a new die leveling method based on auto - focus is presented for the flip chip bonder . auto - focus is completed by estimating from images ; die leveling is completed by focusing for several feature locations
  本文针对倒装贴片机的自动对准系统开展了以下几方面的工作:首先在讨论了现有的对准方法和自动贴片机的对准光路系统基础上,针对贴片机实际应用环境,提出基于多点自动对焦的芯片调平方法。
• Today , the most advanced alignment methods have used the technology of machine vision and image proceeding , by which the feature marks on dies or substrate are recognized or measured , by which machine movement equipments are leaded to complete alignment . die leveling and auto - focus usually be completed before vision - based alignment of die and substrate
  自动对准系统是自动贴片机中的关键组件之一,现阶段最先进的对准方法是利用机器视觉和图像处理技术来识别和测量微细标记特征,然后反馈给控制系统引导机械装置进行对准定位,在对准之前还必须对芯片进行“调平”以及实现“对焦”获得清晰的标记图像。