钎焊温度的英文

• brazing temperature

• "钎"英文翻译    drill rod; borer
• "焊"英文翻译    weld; solder
• "温度"英文翻译    temperature
• "锻焊温度" 英文翻译 :    sweating heat
• "钎焊" 英文翻译 :    blazing; brass solder; braze welding; brazed; junction; soldering and brazing; soldering bit; soldering hammer; sweat
• "角钎焊" 英文翻译 :    fillet brazing
• "块钎焊" 英文翻译 :    block brazing
• "冷钎焊" 英文翻译 :    cold soldering
• "铝钎焊" 英文翻译 :    aluminium soldering
• "钎焊，铜焊" 英文翻译 :    brazing
• "钎焊笔" 英文翻译 :    soldering pencil
• "钎焊的" 英文翻译 :    brazed
• "钎焊灯" 英文翻译 :    blast lamp; blowlamp; blowtorch; brazing burner
• "钎焊法" 英文翻译 :    brazing process
• "钎焊粉" 英文翻译 :    soldering powder
• "钎焊膏" 英文翻译 :    solder paste; soldering fat; soldering paste
• "钎焊工" 英文翻译 :    of brazers; solderer
• "钎焊盒" 英文翻译 :    brazing retort
• "钎焊机" 英文翻译 :    brazing machine; solderer; soldering machine
• "钎焊剂" 英文翻译 :    fluxes; soldering powder; soler
• "钎焊接" 英文翻译 :    braze welding
• "钎焊炉" 英文翻译 :    brazing furnace
• "钎焊面" 英文翻译 :    faying face
• "钎焊片" 英文翻译 :    brazing sheet
• "钎焊器" 英文翻译 :    solderer; soldering tool

• Semiconductor devices - mechanical and climatic test methods - resistance to soldering temperature for through - hole mounted devices
  半导体器件.机械和气候试验方法.通孔安装设备的耐钎焊温度
• Semiconductor devices - mechanical and climatic test methods - part 15 : resistance to soldering temperature for through - hole mounted devices
  半导体器件.机械和气候试验方法.第15部分:通孔安装设备的耐钎焊温度
• Semiconductor devices - mechanical and climatic test methods - part 15 : resistance to soldering temperature for through - hole mounted devices
  半导体装置.机械和气候试验方法.第15部分:通孔安装装置的耐钎焊温度性能
• The analysis results indicate that the correlative influence factors to the technological capabilities of electronic solders include the composition and purity and chemical uniformity of solder alloy , the composition and properties of mother materials and their clean level on the surface , the surface tension of liquid state solders , the temperature and atmosphere in soldering and the activity of flux , the chemical composition and structure and properties of the surface film of melting solders , and so on
  分析表明：相关的影响因素主要包括合金的组成、纯度和化学均匀性；母材的成分、性质和表面的洁净度；液态焊料的表面张力；钎焊温度、气氛、助焊剂的活性；液态焊料表面膜的组成、结构和性能等。