键合点的英文

• bonding pad
• bonding site

• "键合"英文翻译    interlinking; bonding; linka ...
• "点"英文翻译    drop
• "合点" 英文翻译 :    chalaza; vanishing point
• "键合" 英文翻译 :    interlinking; [化学] bonding; linkage
• "闭合点" 英文翻译 :    closing point
• "叠合点" 英文翻译 :    coincidence point
• "辐合点" 英文翻译 :    convergence point; convergency point
• "符合点" 英文翻译 :    corresponding point
• "合点袋" 英文翻译 :    chalazal pocket
• "合点端" 英文翻译 :    chalazal end
• "合点核" 英文翻译 :    chalazal nucleus
• "合点腔" 英文翻译 :    chalazal chamber
• "会合点" 英文翻译 :    confluence; meeting point; meeting-point; point of junction; rendezvous point
• "汇合点" 英文翻译 :    confluence; confluent; convergence point; meeting; merge point; point
• "混合点" 英文翻译 :    mixing point
• "集合点" 英文翻译 :    assembly point; assembly post; cp consolidation point; meeting point; point of assembly; rendezvous
• "接合点" 英文翻译 :    binding site; bonding point; jct; joint; junction point; juncture; tie point
• "结合点" 英文翻译 :    bonding point; juncture
• "聚合点" 英文翻译 :    congruent point
• "离合点" 英文翻译 :    clutch point
• "络合点" 英文翻译 :    hapto
• "拟合点" 英文翻译 :    fit points; point fit
• "啮合点" 英文翻译 :    contact points; engagement point; mesh point; meshing point; point of engagement
• "偶合点" 英文翻译 :    coupling point; coupling range
• "融合点" 英文翻译 :    fuse points

• Through these results , further studies on the 1st bonding mechanism and corresponding routines would benefit from presented work above
  采用正交试验法对相关因素进行了研究试验，取得了相应的试验结果，为深入?解第一键合点质量的影响机理和规律提供了依据。
• Research on interface shows the joint begins at the bond periphery , then the center area of the joint , and at last the achievement of connection of the whole joint
  键合试验发现:键合点的形成始于键合点周边,然后是键合点中心区域,最后完成整个界面的连接。
• The whole process of copper wire ball bonding and gold wire ball bonding were compared and analyzed , and a central composite design of experiment ( doe ) approach was applied to optimize the parameters of free air ball formation process and bonding process , separately
  本文首先对比分析了铜丝球键合和金丝球键合的全过程,采用实验设计分别对烧球工艺参数和键合工艺参数进行了优化。在此优化参数下,获得了连接良好的铜丝球键合点和金丝球键合点。
• A reliability experiment of thermal aging was carried out for the two types of joints , scanning electron microscopy , energy dispersive x - ray spectrometer and micro x - ray diffractomer were adopted to investigate the interfacial evolution behavior of joints , and kinetics model of imc formation was established . the results show that imc growth follows the parabolic law as a function of aging time at certain aging temperature , imc growth is more sensitive to the aging temperature than the aging time , the activation energy of cu - al imc growth is 97 . 1kj / mol and the major forming cu - al imc are cual2 and cu9al4 , the activation energy of au - al imc growth is 40 . 1kj / mol and the main au - al imc are au4al and au5al2 , with au2al and aual at the interfacial periphery of joints , the rate of cu - al imc growth is about 1000 times slower than that of au - al imc , and kirkendall voids and cracks are easily appeared during thermal aging in gold ball bonds while voids and cracks are absent in copper ball bonds even after aging at 200 for 2900 hours and 250 for 169 hours
  研究结果表明:金属间化合物厚度与老化时间的关系符合抛物线法则,金属间化合物的生长对老化温度比老化时间更加敏感; cu - al金属间化合物生长的激活能为97 . 1kj / mol ,老化后金属间化合物呈层状分布,主要相为cual2和cu9al4 ; au - al金属间化合物生长的激活能为40 . 1kj / mol ,主要相为au4al和au5al2 ,同时在界面周边区域生成了au2al和aual ;老化过程中cu - al金属间化合物生长速率比au - al金属间化合物生长速率小103数量级;金丝球键合点200老化96小时出现了明显的kirkendall空洞和裂纹,但铜丝球键合点200老化2900小时和250老化169小时都没有形成空洞和裂纹。

• 键合点的日语：ボンディングポイント ボンディング端子 ボンディングたんし