镀通孔的英文

• plated through hole (pth)
• plated through-hole (pth)
• plated thru-hole

• "镀"英文翻译    plate
• "通"英文翻译    open up or clear out by poki ...
• "孔"英文翻译    hole; opening; aperture
• "通孔；镀通孔" 英文翻译 :    via
• "非镀通孔" 英文翻译 :    unsupported hole
• "非镀通孔非支撑孔" 英文翻译 :    unsupported hole
• "通孔" 英文翻译 :    abbohren; body size hole; clear opening; feedthrough; interlock pore; open-end hole; through hole; through-hole
• "镀通板" 英文翻译 :    plated thru-board; plated thruboardd
• "镀通电路板" 英文翻译 :    board plated-through; plated through-board
• "通孔, 贯通孔" 英文翻译 :    thru hole
• "不通孔" 英文翻译 :    blind hole; blinding hole; dead hole; unfair hole
• "穿通孔" 英文翻译 :    clearance hole; full length bore; punched hole; reach through hole; through hole
• "导通孔" 英文翻译 :    pth (plating though hole); pth :plated thru hole; via hole
• "贯通孔" 英文翻译 :    communicating pores; through hole; thru hole
• "互通孔" 英文翻译 :    intercommunicating porosity
• "交通孔" 英文翻译 :    access hole
• "联通孔" 英文翻译 :    interlocking pore
• "连通孔" 英文翻译 :    communication pore; intercommunicating pores; intercommunicating porosity; interconnected pore; interconnecting pores; interlocking pore
• "埋通孔" 英文翻译 :    buried via; via buried; via, buried
• "盲通孔" 英文翻译 :    blind via; via blind; via, blind
• "旁通孔" 英文翻译 :    by pass port; by-pass port; by-pass prot; bypass opening; bypass orifice
• "通孔廷" 英文翻译 :    toncontin
• "外通孔" 英文翻译 :    accessible porosity
• "乌通孔" 英文翻译 :    utonkon
• "直通孔" 英文翻译 :    durchgangsbohrung through-hole

• System of quality assessment - sectional specification - rigid double - sided printed boards with plated - through holes
  质量评估体系.分规范.有镀通孔的刚性双面印制板
• Interstitial via hole : an embedded through - hole with connection of two or more conductor layers in a multilayer pcb
  埋孔：多层pcb内的连接两个或以上导体层的镀通孔。
• Reliability of plated through hole ( pth ) has close relationship with technology parameters during manufacture process
  摘要镀通孔的可靠性与制造过程工艺参数有非常密切的关系。
• Is plated copper being test in the environmental test chamber ? if so , what is the test frequency
  对于镀通孔，测试是否在（可设定条件的）环境舱内进行？如果是，测试频率是多少？
• System of quality assessment - capability detail specification - rigid double - sided printed boards with plated - through holes
  质量评估体系.性能详细规范.带镀通孔的刚性双面印制板
• Capability detail specification : single and double sided printed boards with plated - through holes ; german version en 123200 - 800 : 1992
  性能详细规范.带电镀通孔的单面和双面印制电路板
• Harmonized system of quality assessment for electronic components : sectional specification : single and double sided printed boards with plated through holes
  电子元器件质量评定统一体系.分规范:具有镀通孔的单面和双面印制电路板
• Current research of failure mechanism and physics model of pth in manufacture process including drilling , electroless plating and electroplate were reviewed
  从钻孔、化学镀铜、电镀三个主要工艺入手，对目前制造过程镀通孔失效的机理与物理模型的研究现状进行总结。