集成电路工艺技术的英文

• integrated circuit processing technique

• "集成电路"英文翻译    integrated circuit; unicircu ...
• "工艺"英文翻译    technology; craft; industria ...
• "技术"英文翻译    technology; skill; technique ...
• "电子集成电路工艺" 英文翻译 :    electronic integrated circuit technology
• "高速集成电路工艺" 英文翻译 :    high speed ic technology; high speed process
• "集成电路工艺学" 英文翻译 :    ic process technology; integrated circuit technology
• "按比列缩小集成电路工艺" 英文翻译 :    scaled process
• "半定制集成电路工艺" 英文翻译 :    semicustom process
• "大规模集成电路工艺" 英文翻译 :    lsi technology
• "集成电路工艺实验室" 英文翻译 :    ic process lab
• "外延钝化集成电路工艺" 英文翻译 :    epic process
• "中规模集成电路工艺" 英文翻译 :    msi technology
• "自对位，自准（集成电路工艺用）" 英文翻译 :    artoregistration
• "集成电路技术" 英文翻译 :    ic technology; integrated circuit technique; integrated circuit technology
• "干法工艺集成电路" 英文翻译 :    dry processed integrated circuit
• "集成电路先进工艺" 英文翻译 :    integrated circuit advanced technology
• "集成电路制造工艺" 英文翻译 :    ic manufacturing processes
• "集成电路制作工艺" 英文翻译 :    ic processing
• "定制集成电路技术" 英文翻译 :    custom approach
• "高技术集成电路" 英文翻译 :    high technology integrated circuit
• "混合集成电路技术" 英文翻译 :    hybrid-integrated circuit
• "集成电路布局技术" 英文翻译 :    topology
• "集成电路隔离技术" 英文翻译 :    ic isolation technique
• "集成电路芯片技术" 英文翻译 :    microchip technology
• "集成电路制造技术" 英文翻译 :    dry process

• Study of the silicon carbide integrate circuits technique
  单片集成电路工艺技术
• With the development of integrated circuit , fpga and asic have been widely used in many fields such as telecommunication . image processing , vedio compression and so on
  随着集成电路工艺技术的发展， fpga和专用集成电路( asic )越来越多地应用到通信、图像处理和视频处理等领域。
• With the development of integrated circuit , fpga and dsp processors have been widely used in many fields such as telecommunication , image processing , pattern recognization and so on
  随着集成电路工艺技术的发展， fpga和dsp处理器越来越多地应用到通信、图像处理和模式识别等领域。
• Being one of the leading foundry service enterprise , hejian is geared with an excellent management team along with state - of - art ic technology as to provide comprehensive and competitive service to her customer
  公司拥有尖端的集成电路工艺技术和杰出的经营团队，为客户提供全面性及具有竞争力的服务。
• By studying and using conventional 1c process in combination with electron beam lithography ( ebl ) , reactive ion etching ( rie ) and lift - off process , several efficient results are produced : semiconductor and metal nano - structures are fabricated ; the matching problem of photolithography and electron beam lithography is well solved ; the process efficiency is improved ; the process is offered for the controlled fabrication of nano - structures by repetitious process testing ; several nano - structures such as si quantum wires , si quantum dots , double quantum dot structures and tri - wire metal gate are firstly fabricated by using ebl and rie processes
  研究利用常规的硅集成电路工艺技术结合电子束光刻，反应离子刻蚀和剥离等技术制备半导体和金属纳米结构，很好地解决了普通光刻与电子束光刻的匹配问题，提高了加工效率，经过多次的工艺实验，摸索出一套制备纳米结构的工艺方法，首次用电子束光刻，反应离子刻蚀和剥离等技术制备出了多种纳米结构(硅量子线、量子点，双量子点和三叉指状的金属栅结构) 。