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buffer layer中文是什么意思

  • 缓冲层

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  • 例句与用法
  • ( 2 ) the ysz and sto buffer layers were prepared by sol - gel process on si substrates . the ysz and sto films could be used as the buffer layers between si substrate and ybco films
    ( 2 )用sol - gel法在si基板上制的钇稳定氧化锆( ysz )和钛酸锶( sto )薄膜作为si与ybco间的缓冲层是可行的。
  • The layers from substrate to top of the deposited film are ti substrate , buffer layer ( interface between substrate and film ) , porous layer and lamellar layer
    研究发现,从钛合金到羟基磷灰石共有四层结构:钛合金基体、钛合金的氧化层、多孔的纳米晶羟基磷灰石和花瓣状的结晶良好的羟基磷灰石。
  • By means of quantitative analysis , we accessed growth rate and film thickness of gan epilayer , and even determined in real time the thickness of buffer layer from in situ measurements of normal incidence reflectance
    通过对在位监测曲线的分析,确定gan生长速率以及外延层的厚度,并利用监测曲线实时标定缓冲层的厚度。
  • This model described relationship of current collapse and traps in buffer layer , and the normalized product of electron mobility and 2deg density with and without current collapses was 0 . 95 vgs
    该模型描述了电流崩塌效应与缓冲层中陷阱的相互关系,并获得了电流崩塌前后迁移率与二维电子气浓度乘积的归一化值0 . 95 vgs 。
  • In order to deal with large mismatch ( 14 . 6 % at room temperature ) between gaas and insb , a insb buffer layer was deposited firstly at low temperature 350 , followed by a insb epilayer being deposited at higher temperature 440
    为了克服insb与gaas间14 . 6 %的晶格失配度,实验设计先低温生长一定厚度的insb缓冲层,随后升温生长insb外延层。
  • It was thought that zno buffer layer eliminates the imbalance of interface charge and weaken the thermal stress , so that the dislocation between wide band - gap ii - vi materials and si substrate would be decreased
    认为由于zno的存在消除了电荷不匹配以及减少热应力对在si衬底上生长宽带-族半导体材料带来的影响从而减少界面间的缺陷的产生。
  • 2 、 in order to solve the phenomenon of the outdiffusion of the base dopant , two solutions are suggested : 1 ) the sige : c base can effectively solve the outdiffusion problem ; 2 ) the undoped buffer layer can constrict the outdiffusion phenomenon
    2 、为了解决基区杂质外扩现象,提出了两种方案: 1 )采用掺碳的sige : c基区层,能够有效消除外扩问题; 2 )采用未掺杂的缓冲层i - sige ,能够有效抑制外扩现象。
  • In this thesis , the cvd technique and “ two - step growth process ” were used to deposit the 3c - sic films , that was to carbonize si substrate in carbide gas atmosphere first in order to form a buffer layer , then deposited the 3c - sic films on this buffer layer
    本论文采用cvd方法,并结合“两步生长工艺”进行3c - sic的异质外延生长。即:首先将si基片碳化,形成一个碳化缓冲层,然后再在此缓冲层上异质外延生长3c - sic薄膜。
  • In order to increase the thickness and improve the quality of sputtered films , low deposition rate and 30nm ta buffer layer on substrate have been adopted . as a result , 3 u m single films and 2 . 6 u m / 2 . 6 u m 72 . 6 u m sandwiched films have been successfully prepared
    通过降低溅射速率和在基底上沉积30nm的tabuffer (缓冲层) ,解决了难以溅射生长厚膜的问题,成功制备了厚度3 m的单层膜和每层厚度2 . 6 m的三明治膜。
  • Zno thin film had a better crystallization with increase the substrate temperature . the buffer layer thickness effected crystalline quality and morphology of zno thin film . the results showed that the film had the best crystalline qulity and morphology when the buffer later thickness was 36nm
    缓冲层的厚度对薄膜的结晶质量和表面形貌有很大的影响,研究发现,缓冲层厚度36nm时, zno薄膜有最优的取向和最平滑的表面。
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