polyimide中文是什么意思

• 聚亚胺
• 聚亚醯氨
• 聚酰亚胺

• addition polyimide    加成型聚酰亚胺
• aliphatic polyimide    脂族聚酰亚胺; 脂族聚醯亚胺
• aromatic polyimide    芳族聚酰亚胺
• crosslinked polyimide    交联聚酰亚胺
• pi polyimide    聚酰胺; 聚酰亚胺; 聚醯亚胺
• polyimide adhesive    聚酰亚胺粘合剂
• polyimide coating    聚醯亚胺涂敷
• polyimide fibre    聚酰亚胺纤维
• polyimide film    聚酰亚胺胺薄膜; 聚酰亚胺膜
• polyimide resin    聚烯亚胺树脂; 聚酰亚氨树脂; 聚酰亚胺树脂
• soluble polyimide    可溶性聚酰亚胺
• aromatic polyimide fibre    芳族聚酰亚胺纤维
• boron-reionforced polyimide    硼增强聚酰亚胺
• polyimide coated optical fiber    聚酰亚胺涂层光纤; 聚酰亚胺涂覆光纤
• polyimide enamelled copper wire    聚酰亚氨漆包铜线
• polyimide enamelled wire    聚酰亚胺漆包线
• polyimide film (pi)    聚酰亚胺薄膜
• polyimide enamelled round copper wire    聚酰亚胺漆包铜圆线
• polyimidazoquinazoline    聚咪唑并喹唑啉
• polyimidazopyrrolone    聚咪唑并吡咯酮
• polyimidazopyrolone    聚咪唑并吡咯酮
• polyimidazolidinone    聚咪唑烷酮
• polyimidazoledione    聚脲基酸内酰胺

• Enamelled round winding wires - part 6 : polyimide enamelled round copper wires with a temperature index of 220
  漆包圆绕组线第6部分:温度指数220的聚酰亚胺漆包圆铜线
• Fabrication of polyimide silver composite films and study on the relationship between morphology and properties of the films
  银复合膜的制备及其亚微相态与性能研究
• In the system of pfb5 and pff5 , fluorene units and perylene units were incorporated into polyimide chain
  对链内键合染料小分子聚合物led的能量转移现象进行了研究。
• Specifications for particular types of winding wires . part 7 : polyimide enamelled round copper wire , class 220
  特种绕组线规范.第7部分: 220级聚酰亚胺漆包涂覆圆铜线
• Specifications for particular types of winding wires ; part 7 : polyimide enamelled round copper wire , class 220
  特种绕组线规范.第7部分:聚酰亚胺漆包圆铜绕组线, 220级
• Specifications for particular types of winding wires . part 30 : polyimide enamelled rectangular copper wire , class 220
  特种绕组线规范.第30部分: 220级聚酰亚胺涂覆扁铜线
• Prepreg for multilayer printed wiring boards - modified or unmodified polyimide resin - impregnated glass cloth
  多层印制电路板的半固化片.改性和未改性浸聚酰亚胺树脂玻璃布
• Studies on polyimide membranes for pervaporation preparation and effect of membrane structure on dynamic sorption behavior in membrane
  膜的制备和结构对动态吸附特性的影响
• Base material for printed circuits - specifications - flexible copper - clad polyimide film , general purpose grade
  印制电路板基材.第2部分:规范.第13节:通用柔性覆铜聚酰亚胺膜
• Specifications for particular types of winding wires ; part 30 : polyimide enamelled rectangular copper wire , class 220
  特种绕组线规范.第30部分:聚酰亚胺漆包扁铜绕组线, 220级

• polyimideとは意味：{名} : ポリイミド