倒装芯片的英文

• face down chip
• flichip
• flipped chip

• "倒装"英文翻译    upside down mounting; upside ...
• "芯片"英文翻译    slug; chip; die; wafer
• "倒装芯片座" 英文翻译 :    flip chip carrier
• "倒装芯片贴装，倒装芯片附着" 英文翻译 :    flichiattach (fca)
• "倒装芯片附着" 英文翻译 :    flichiattach
• "倒装芯片贴装" 英文翻译 :    flichiattach
• "倒装芯片集成电路" 英文翻译 :    face down integrated circuit; flip chip integrated circuit
• "倒装芯片隆起焊盘" 英文翻译 :    flip chip bump
• "球形引线倒装芯片" 英文翻译 :    balls down chip
• "未封装芯片" 英文翻译 :    unpackaged chip
• "倒装式芯片" 英文翻译 :    flip-chip; flipchipp
• "芯片级封装芯片级安装" 英文翻译 :    chiscale package
• "装芯" 英文翻译 :    cored
• "倒装式芯片技术" 英文翻译 :    flip-chitechnology
• "倒装焊接倒扣芯片焊接" 英文翻译 :    flip-chip bonding
• "倒装" 英文翻译 :    upside down mounting (集成电路组装的); upside-down charging◇倒装词序 [语言学] inverted word order; 倒装法 upside-down mounting; flip-chip; [语言学] anastrophe; 倒装句 [语言学] inverted sentence; 倒装小齿轮 contravane
• "芯片" 英文翻译 :    slug; chip; die; wafer
• "倒装法" 英文翻译 :    anastrophen; flip chip approach; flip chip method; flip-chip; hyperbaton; u ide-down method of hull section co truction; up-side-down mounting; upside-down method of hull section construction
• "倒装焊" 英文翻译 :    fcb flichibonding
• "倒装句" 英文翻译 :    inversion; inverted sentence
• "倒装模" 英文翻译 :    inverted mold; inverted mould
• "倒装片" 英文翻译 :    flip-chip
• "倒装式" 英文翻译 :    flitab
• "倒装置" 英文翻译 :    focusing device; focusing mechanism
• "板上倒装片" 英文翻译 :    fcob flichion board

• The reworkable underfills technology for flip chip
  倒装芯片的可修复底部填充技术
• Research on the thermode bonding procee for flip chip
  倒装芯片热电极键合工艺研究
• Flip chip will be a new method of packaging technology
  倒装芯片将成为封装技术的最新手段
• Bump fabrication methods for flip chip
  倒装芯片凸点制作方法
• Screen printing technology for solder ball flip chip for smt
  倒装芯片及晶圆和基底凸起的网版印刷技术一
• Current research on the reaction between solder bump and under bump metallurgy systems in flip chip
  倒装芯片中凸点与凸点下金属层反应的研究现状
• Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
  集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
• The assembly process and experimental results are included in this paper . in order to increase the power density of the module , a three - dimensional fc - ipem package structure is introduced . a half - bridge fc - ipem module is built in the lab with bga power devices and flip - chip technique
  为实现更高的功率密度，本文把微电子行业中广泛应用的倒装芯片技术应用于模块电源研究中，完成了一个半桥fc - ipem ( flipchip - integratedpowerelectronicsmodule )模块。