灌封材料的英文

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"灌封材料"怎么读用"灌封材料"造句

英文翻译手机版

embedding material
encapsulating material
material, encapsulating

"灌封"英文翻译 embedment
"材料"英文翻译 material
"电器灌封材料" 英文翻译 : electrical equipment potting material
"密封材料" 英文翻译 : abdichtmaterial; abdichtungsmasse; air locking; caulks/coatings/sealants; compacting material; encapsulant; leakproof material; packing material; sealant material; sealers; sealing material
"弹性密封材料" 英文翻译 : elaxtic sealing
"胶囊密封材料" 英文翻译 : encapsulant
"接缝密封材料" 英文翻译 : joint sealers
"接合密封材料" 英文翻译 : joining material; jointing material
"密封材料成分" 英文翻译 : seal component materials
"密封剂；密封材料" 英文翻译 : sealant
"塑性密封材料" 英文翻译 : plastic sealant
"单组分密封材料" 英文翻译 : one component sealant
"点焊用密封材料" 英文翻译 : spot welding sealer; spot-welding sealer
"电缆连接密封材料" 英文翻译 : airproof connection pvc material; weather-proof connection pvc material
"多组分密封材料" 英文翻译 : multicomponent sealantt
"非结构密封材料" 英文翻译 : nonstructural sealing materiall
"非下垂型密封材料" 英文翻译 : non-sag sealant
"环氧树脂塑封材料" 英文翻译 : epoxy powder coating material
"建筑密封材料术语" 英文翻译 : building sealing material vocabulary
"沥青胶泥密封材料" 英文翻译 : asphaltic mastic caulking material
"乳液型密封材料" 英文翻译 : latex sealant
"填充料,填料,密封材料" 英文翻译 : packing material
"灌封" 英文翻译 : embedment◇灌封机 filling and sealing machine; 灌封料 potting compound
"埃尔林密封材料有限公司" 英文翻译 : elring dichtungswerke gmbh
"丙烯酸表面密封材料" 英文翻译 : acrylic bulk compound; acrylic compound

例句与用法

Development of organic silicon encapsulation
有机硅灌封材料的研究进展
Encapsulation materials of expoy series for use in electronic components
电子元器件用环氧系灌封材料
Morphology and mechanical properties of mg pu ep encapsulating composite
环氧灌封材料的形态结构与力学性能
Based on the over research , three different kinds of encapsulating materials of epoxy resin are performed
在各种不同制备方法研究的基础上，选用不同的改性体系制备出环氧灌封材料，并对其性能作了评价。
Test method for shrinkage stresses in plastic embedment materials using a photoelastic technique for electronic and similar applications
用光弹性技术测定电子及类似用途的塑料灌封材料的收缩应力的试验方法
Low viscosity , easily pourable potting material , with the ability to develop good adhesion to most substrates without the use of a primer , has a long working time and high temperature resistance , cure at elevated temperature
低粘度，易浇注的灌封材料，并在不需要底涂的情况下能获得较好的粘接性，操作时间长，耐高温，需加热固化。
Encapsulating materials of epoxy resin are modified with hgh , nano - sio2 and organophilic montmorillonite , in the present investigation , the microstructue , some properties and influence factors about nano - sio2 and organophilic montmorillonite modified encapsulatig materials have been systematically studied using x - ray diffraction , electron microscopy and differential thermal analysis measurement techniques
随着航空、电子等事业的发展，灌封器件的高性能化对灌封材料提出了越来越高的要求。探索制备环氧灌封材料的新方法，寻求提高其使用性能的有效途径是该领域研究的重要课题。
This paper mainly described the research on rheological property , high thermal stability , flame retardant , the influence of catalyst and insulating heat conduction of organic silicon encapsulating materials , which greatly apply on electronic equipment and large scale integrated circuit and so forth
摘要本文主要综述了国内外用于电子元器件、大规模集成电路等高科技领域的有机硅灌封材料在流动、耐高温、阻燃和绝缘导热等方面的性能以及催化剂对灌封材料的影响的研究应用进展。
Test results show that that the breakcown voltage and heat distortion temperature the encapsulating materials of epoxy resin with hgh are famously improved , but the the addition of hgh , the viscosities of the epoxy resin - hgh system is higher compared with that of the others and the encapsulating process is effected . nano - sio2 improves the mechanical properties of encapsulating materials of epoxy resin , impact strength reaches 27 . 64kj / m2 from 13 . 95 kj / m2 , flexural strength reaches 136 . 68mpa from64 . 95 mpa . by addition of the montmorillonite , glass transition temperature and heat distortion temperature of the encapsulating materials are 13 . 2 and 16 higher than that of epoxy re
结果表明，活性硅微粉对环氧灌封材料的热变形温度和电学性能提高较为显著，尤其在浸水后，电学性能降低幅度很小，西北工业大学硕士学位论文但活性硅微粉用量较大，材料的工艺性能明显降低;纳米5102对环氧灌封材料具有显著的增强和增韧作用，冲击强度、弯曲强度由原来的13 . 95kj / mz和64 . 95mpa分别提高到27 . 64kjzm2和136 . 68mpa 。