裸芯片的英文

• bare chip
• unpacked chip

• "裸"英文翻译    exposed; naked; bare; nude
• "芯片"英文翻译    slug; chip; die; wafer
• "裸体芯片组装裸芯片安装" 英文翻译 :    bare chiassembly
• "芯片" 英文翻译 :    slug; chip; die; wafer
• "cmos芯片" 英文翻译 :    cmos chip
• "dna芯片" 英文翻译 :    dna arrays; dna microarray
• "ic芯片" 英文翻译 :    integrated circuit
• "薄芯片" 英文翻译 :    led reverse mounting type
• "单芯片" 英文翻译 :    one-dimentional language
• "多芯片" 英文翻译 :    multi-chiic
• "硅芯片" 英文翻译 :    silicon chip
• "宏芯片" 英文翻译 :    macro chip
• "磊芯片" 英文翻译 :    led epi wafer
• "铁芯片" 英文翻译 :    lamination
• "微芯片" 英文翻译 :    microchip
• "芯片板" 英文翻译 :    chiboard
• "芯片集" 英文翻译 :    chip set; chipset
• "芯片级" 英文翻译 :    onc on chip
• "芯片卡" 英文翻译 :    chi card; chicard; chip card; chips carried by cards
• "芯片模" 英文翻译 :    die
• "芯片骚" 英文翻译 :    chienable
• "芯片上" 英文翻译 :    onchipp
• "芯片业" 英文翻译 :    chip industry
• "芯片战" 英文翻译 :    chip war
• "芯片组" 英文翻译 :    almador almador; chip set; chip system; chipset

• Multichip module ( mcm ) is high - level mode in electronic package . mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate . mcm can meet the demands of compact packaging and high density
  多芯片组件( mcm )是微电子封装的高级形式，它是把裸芯片与微型元件组装在同一个高密度布线基板上，组成能够完成一定的功能的模块甚至子系统。
• Finite element method ( fem ) was used to simulate thermal and vibration problems in stacked - die csp assembly . finite element models and apdl programes were built in ansys to conduct thermal , thermal - mechanical and vibration analysis . the aim of these researches were trying to find some possible reasons and trends which affect the reliability of stacked csp / bga assembly and give some useful suggestions for the packaging design
  本论文正是针对以上情况,以采用引线键合工艺的三维叠层csp / bga封装(裸芯片叠装)为研究对象,在有限元分析软件ansys中建立相关的有限元模型,编制了相应的apdl参数化分析程序,进行了温度场分析、热循环加载下的snpb合金焊点疲劳分析和实装pcb板的振动模态分析。