陶瓷基片的英文

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"陶瓷基片"怎么读用"陶瓷基片"造句

英文翻译手机版

ceramic substrate
ceramic wafer

"陶瓷"英文翻译 pottery and porcelain; ceram ...
"基"英文翻译 base; foundation
"片"英文翻译 a flat,thin piece; slice; fl ...
"陶瓷基片印刷电路" 英文翻译 : cpc ceramic wafer printed circuit
"薄膜集成电路用氧化铝陶瓷基片" 英文翻译 : alumina ceramic substrates for thin film integrated circuits
"厚膜集成电路用氧化铝陶瓷基片" 英文翻译 : alumina ceramic substrates for thick film integrated circuits
"陶瓷基板" 英文翻译 : ceramic wafer; substrate, ceramic
"陶瓷基脆性" 英文翻译 : ceramic based
"陶瓷基砂" 英文翻译 : ceramic base sand
"陶瓷基质" 英文翻译 : ceramic substrate
"陶瓷基覆铜箔板" 英文翻译 : ceramics base copper clad laminates
"陶瓷基复合材料" 英文翻译 : ceramic matrix composites
"陶瓷基无机覆铜板" 英文翻译 : ceramicinorganicbasecoppercladlaminate
"碳膜电阻器用陶瓷基体" 英文翻译 : ceramic base body using in carbon film resistor
"陶瓷基板多芯片组件" 英文翻译 : mcm-c mcm with ceramic substrate
"基片" 英文翻译 : base plate; base sheet; chip; kipen; matrix; non-coated lens; substrate; uropatagia
"瓷基体" 英文翻译 : porcelain basal bodies; porcelain basal body
"瓣基片" 英文翻译 : basivalvula
"翅基片" 英文翻译 : hypoptera; squamula; tegula
"单基片" 英文翻译 : monocrepid
"瓜基片" 英文翻译 : auxliae
"基板,基片" 英文翻译 : base-plate
"基片（电子）" 英文翻译 : substrate
"基片丝" 英文翻译 : base-plate fibril
"基片座" 英文翻译 : substrate holder

例句与用法

Alumina ceramic substrates for thin film integratedcircuits
薄膜集成电路用氧化铝陶瓷基片
Alumina ceramic substrates for microwave integrated circuits
微波集成电路用氧化铝陶瓷基片
Alumina ceramic substrates for thick film integratedcircuits
厚膜集成电路用氧化铝陶瓷基片
Test methods for gross camber of ceramic substrates for thick film applications
厚膜器件陶瓷基片横向弯曲度的试验方法
The mixer is fabricated using hmic process based on the thin film ceramic substrate and tested
该混频器主要采用微带混合集成电路,薄膜陶瓷基片制作。
Product structure : by the ceramic substrate , the back electrode , the resistance body , the surface electrode , glass , two glass , the end electrode , the intermediate electrode , the outer electrode equicomponent constitutes
产品构造：由陶瓷基片、背电极、电阻体、面电极、一次玻璃、二次玻璃、端电极、中间电极、外部电极等成分构成。
Mainly for capacitance , semiconductor , jingzhen , resistance , ic chips , jiechajian procedures , connecting pieces , switching devices , silicon , triode , diode , piezoelectric ceramic base films , tubes , electron tubes , electronic stamping , precision metal parts , production processes between cleansing processes
芯片接插件连接件转接器硅片三极管二极管压电陶瓷基片显象管电真空器件等内精密电子冲压五金零件，生产加工过程工序间的清洗。
Secondly , we have studied the properties of the conbzr high frequency soft - magnetic thin film , and use the dc magnetron sputtering system by conquering the key technology to fabricate double - sides thin - film inductors on 10mm * 10mm printed circuit board and 20mm * 20mm ceramic board
再次，研究了薄膜电感所使用的conbzr高频软磁薄膜材料的性能，并利用真空磁控溅射设备，克服各种关键技术及工艺难度，在10mm 10mm的pcb板、 20mm 20mm陶瓷基片上制作了薄膜电感。