宏力半导体的英文

• grace semiconductor manufacturing
• gsmc

• "宏"英文翻译    great; grand; magnificent
• "半导体"英文翻译    semiconductor
• "宏力半导体制造有限公司" 英文翻译 :    gsmc
• "由宏力半导体制造公司" 英文翻译 :    grace semiconductor manufacturing
• "电力半导体器件" 英文翻译 :    power semiconductor device
• "电力半导体器件用散热器" 英文翻译 :    heat sink for power semiconductor device
• "半导体" 英文翻译 :    semiconductor
• "纯半导体，本征半导体" 英文翻译 :    intrinsic semiconductor
• "alliance半导体" 英文翻译 :    alliance semiconductor
• "alpha半导体" 英文翻译 :    alpha semiconductor
• "n 型半导体" 英文翻译 :    n doped semiconductor; n type semiconductor
• "npn半导体" 英文翻译 :    npn semiconductor
• "n型半导体" 英文翻译 :    n-semiconductor; n-type semiconductor; negative-type semiconductor; semiconductor
• "p 型半导体" 英文翻译 :    p doped semiconductor; p type semiconductor
• "p型半导体" 英文翻译 :    p semiconductor; p type semiconductor; p-type semiconductor; p-type semiconuctor; psemiconductor; semiconductor
• "半导体薄膜" 英文翻译 :    semiconductor film
• "半导体薄片" 英文翻译 :    semiconductor slice; semiconductor wafer
• "半导体冰箱" 英文翻译 :    semiconductor freezer
• "半导体玻璃" 英文翻译 :    semiconducting glass; semiconductor glass
• "半导体材料" 英文翻译 :    list of semiconductor materials; semiconducting materials; semiconductingmaterial; semiconductive materials; semiconductor materials
• "半导体参数" 英文翻译 :    semiconductor parameter
• "半导体测量" 英文翻译 :    measurement of semiconductors; semiconductor materials
• "半导体层" 英文翻译 :    semi-conducting layer; semiconductive layer
• "半导体掺杂" 英文翻译 :    semiconductor doping
• "半导体产品" 英文翻译 :    semiconductors

• Onjanuary22nd , 2005 , the “ zhongshi number one ” digital television ground transmission chip , independently researched by microelectronic research institute of fudan university and produced by shanghai hongli semiconductor and smi , passed the technical evaluation hosted by ministry of education and participated by academicians from chinese academy of sciences and chinese academy of engineering
  2005年1月22日，由复旦大学微电子研究院自主设计、上海宏力半导体和中芯国际本土制造的“中视一号”数字电视地面传输芯片，通过了由国家教育部主持、中国工程院和中国科学院院士参与的技术鉴定。
• China ' s domestic companies included 86 ic design companies : china integrated circuit design co . , ltd . , datang microelectronics , c * core , spreadtrum communication , lhwt , shenzhen state microelectronics , shenzhen zte ic design , hisense hiview tech . , etc . ; 25 manufacturers : smic , huahong nec , hejian , china resources microelectronics , grace semiconductor manufacturing , csmc tech . , asmc , etc ; 10 engaged in packaging and testing , such as nantong fujitsu , jiangsu changjiang electronics , tianshui huatian , 10 semiconductor equipment manufacturers : cetc no . 2 institute , cetc no . 48 institute , beijing sevenstar huachuang , institute of microelectronics of the chinese academy of sciences , institute of optics and electronics of the chinese academy of sciences etc . ; 37 semiconductor materials providers , including grinm semiconductor materials , heraeus zhaoyuan precious metal materials , etc
  国内参展商包括中国华大、大唐微电子、苏州国芯、展讯通信、六合万通、深圳国微、深圳中兴集成电路、海信信芯科技等86家集成电路设计公司；中芯国际、华虹nec 、和舰科技、华润微电子、宏力半导体、华润上华、上海新进等25家主要集成电路制造企业；南通富士通、江苏长电、天水华天等10家封装测试企业；中电科技集团第2研究所、第48研究所、七星华创、中科院微电子所、中科院光电所等10家半导体设备企业；有研硅谷、贺利氏招远等37家半导体材料企业。