组装技术的英文

• package technique
• packaging technique

• "组装"英文翻译    package; assembling; packagi ...
• "技术"英文翻译    technology; skill; technique ...
• "表面组装技术" 英文翻译 :    surface mount technology
• "多片组装技术" 英文翻译 :    multichip assembly technique
• "表面组装技术术语" 英文翻译 :    terminology for surface mount technology
• "高密度组装技术" 英文翻译 :    high density packaging technique
• "积木式组装技术" 英文翻译 :    cordwood technique
• "混合零件之组装技术混安装技术" 英文翻译 :    mixed component mounting technology
• "混合零件之组装技术" 英文翻译 :    mixed component mounting technology; mixed componmt mounting technology
• "梁式引线带组装技术" 英文翻译 :    beam tape technology
• "铁道车辆车钩缓冲装置组装技术条件" 英文翻译 :    assembling specifications of couplers and draftgears for railway cars
• "锡球格状阵列式塑料组装技术" 英文翻译 :    pbga
• "安装技术" 英文翻译 :    field engineering
• "安装技术部" 英文翻译 :    a&d et
• "安装技术员" 英文翻译 :    installing mechanic
• "包装技术" 英文翻译 :    o wrapping technology; package engineering; packaging technique; packaging technology
• "插装技术" 英文翻译 :    tiit through hole mounting technology
• "袋装技术" 英文翻译 :    fill-bag technique
• "封装技术" 英文翻译 :    lga (land grid arry); packaging technique
• "服装技术" 英文翻译 :    costume technology
• "改装技术" 英文翻译 :    electrical equipment modification skills; retrofit technology
• "灌装技术" 英文翻译 :    canning technique; food tilling technique
• "后装技术" 英文翻译 :    after-loading technic; afterloading technique
• "涂装技术" 英文翻译 :    application techniques
• "表面安装技术" 英文翻译 :    smt surface mounting technology; surface mount technology smt; surface mounting technology

• Preliminary discussion on lead - free packaging technology
  无铅组装技术浅析
• Bga enters mainstream of the contemporary assembly technology
  技术成为现代组装技术的主流
• Technical requirements of railway vehicle ' s wheelset installation
  铁道车辆轮对组装技术条件
• Terminology for surface mount technology
  表面组装技术术语
• Assembling specifications of couplers and draft gears for railway car
  铁道车辆车钩缓冲装置组装技术条件
• Mixed component mounting technology
  混合零件之组装技术
• Fabrication of optic coatings on optic fibers through electrostatic self - assembly
  采用静电自组装技术在光纤上制备光学薄膜的研究
• Heat dissipation is a key technology in semiconductor laser arrays and stacks assembling
  散热是半导体激光器列阵及叠阵组装技术中的一项极其关键的技术。
• The architecture is for multi - target cross debuggers using the technique of assembling components
  本文基于构件组装技术,提出了一种多目标机交叉调试器的设计方案。
• Moreover , the manufacturing technic and assembly technology is also one of the important factors that influence the capability of the switch
  因此，制作工艺和组装技术的好坏也是影响开关性能的重要因素。