芯片测试的英文

• chip testing

• "芯片"英文翻译    slug; chip; die; wafer
• "测试"英文翻译    test; testing; checkout; mea ...
• "电子表芯片测试仪" 英文翻译 :    watch chip tester
• "药片测试器" 英文翻译 :    tablet tester
• "圆片测试" 英文翻译 :    wafer test
• "机内测试, 片测试" 英文翻译 :    built-in testing
• "眼科用刀片测试鼓" 英文翻译 :    ophthalmic knife test drum
• "自动圆片测试机" 英文翻译 :    automatic wafer testing machine
• "测试芯片" 英文翻译 :    test chip; test die
• "芯片诊断测试" 英文翻译 :    diagnostic chip test
• "检测风湿因子用载物玻片测试器械包" 英文翻译 :    slide test kit for detection of rheumatoid factor
• "薄片上的测试芯片组" 英文翻译 :    drop in test group
• "芯片" 英文翻译 :    slug; chip; die; wafer
• "底片测量尺" 英文翻译 :    film-measuring rule
• "骨片测量器" 英文翻译 :    sphenometer
• "胶片测量" 英文翻译 :    film measusrement
• "胶片测量尺" 英文翻译 :    film measuring rule
• "皮片测量器" 英文翻译 :    graft measurer
• "透片测量器" 英文翻译 :    lens measuring instrument; lensmeasuringinstrument
• "相片测倾仪" 英文翻译 :    topoangulator
• "相片测图" 英文翻译 :    photomapping
• "像片测量仪" 英文翻译 :    image measuring apparatus
• "像片测图" 英文翻译 :    picture restitution
• "楔片测温计" 英文翻译 :    wedge pyrometer
• "薄片测量设备" 英文翻译 :    wafer measurig equipment

• Bluetooth headset main chip testing f
  蓝牙耳机主芯片测试架
• Test results show an excellent performance of the chip
  芯片测试结果显示芯片性能优异,达到预期的设计要求。
• Study on test control for system - on - a - chip based on test data slicing
  基于数据切片的系统芯片测试控制技术研究
• To debug on the hardware , eliminate circuitry errors , and test on every chip . 3
  对板卡硬件调试，线路排错，芯片测试； 3
• Because the truly characteristic of random numbers ca n ' t be proved by testing the chip , it ' s very important to guarantee it in the theory
  由于随机数的真随机性不可能在芯片测试时得到证明，因此在理论上保证它的真随机性显得尤为的重要。
• Test results show that this adc achieves the snr of 90 db and distortion ratio of 0 . 0248 % for a 20khz signal bandwidth while operating under a single 3 . 3v supply
  芯片测试结果显示其信噪比达到90db ,总谐波失真0 . 0248 % ,基本达到了预期的设计指标。
• The testing of the chip is faced with very serious challenge , the cost of testing is always rising , and even larger than the designing and manufacturing cost
  芯片测试遇到了前所未有的挑战，测试费用越来越高，出现了设计、生产费用与测试费用倒挂的局面。
• Based on that , the author simulated most of the sub - block circuits and whole chip circuit by applying eda tools hspice . the simulation results indicate that the ic has achieved the expectation ,
  理论分析、仿真结果和芯片测试数据表明,在典型情况下,该电路的电流控制精度相对误差和匹配相对误差可以控制在0 . 5 %以内,达到了预定设计目标。
• With the sharp development of lsi and vlsi , the integration of chip gets denser and denser . but the extra ports for testing is limited and test is more difficult than before . we even must spend more time and money on chip testing rather than chip design
  大规模集成和超大规模集成电路迅速发展，使芯片的集成度越来越高，而供外部测试的引脚却很少，测试问题日趋困难，甚至使芯片测试比芯片本身的设计和生产要付出更高的代价。
• We aslo get the theory of verification test and design debug discussed , and then , some work on the verification test of this integrated circuits have been done . for the sake of finding out the reason of noise occurring in circuit of oscillator , we probe into causation of technics and mechanism
  论文最后基于芯片测试理论,针对芯片流片后的部分测试结果,对振荡出现的噪声问题给出了初步分析,并结合投片工艺探讨了工艺原因与产生机理。